Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
VLD, HWS, ICD |
2024-02-29 12:05 |
Okinawa |
(Primary: On-site, Secondary: Online) |
Shuhei Yokota, Rikuu Hasegawa, Kazuki Monta, Takaki Okidono, Takuji Miki, Makoto Nagata (Kobe Univercity) VLD2023-112 HWS2023-72 ICD2023-101 |
With the rapid development of electronic technology, the level of integration of electronic devices is clearly on the ri... [more] |
VLD2023-112 HWS2023-72 ICD2023-101 pp.77-82 |
VLD, HWS, ICD |
2024-03-01 11:15 |
Okinawa |
(Primary: On-site, Secondary: Online) |
Investigation of electromagnetic irradiation noise reduction by on-chip LDOs Rikuu Hasegawa, Kazuki Monta, Takuya Wadatsumi, Takuji Miki, Makoto Nagata (Kobe Univ.) VLD2023-124 HWS2023-84 ICD2023-113 |
IC chips are subject to the threat of fault injection attacks, which cause circuit malfunctions (faults) by injecting il... [more] |
VLD2023-124 HWS2023-84 ICD2023-113 pp.131-134 |
VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] |
2023-11-17 09:35 |
Kumamoto |
Civic Auditorium Sears Home Yume Hall (Primary: On-site, Secondary: Online) |
Backside Side-Channel Attack by Silicon Substrate Voltage and Simulation Rikuu Hasegawa, Kazuki Monta, Takuya Watatsumi, Takuji Miki, Makoto Nagata (Kobe Univ) VLD2023-63 ICD2023-71 DC2023-70 RECONF2023-66 |
Integrated circuit (IC) chips equipped with cryptographic circuits are vulnerable to side-channel attacks, which use exp... [more] |
VLD2023-63 ICD2023-71 DC2023-70 RECONF2023-66 pp.173-177 |
VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] |
2023-11-17 10:00 |
Kumamoto |
Civic Auditorium Sears Home Yume Hall (Primary: On-site, Secondary: Online) |
Derivation of secret keys by differential fault analysis using backside voltage fault injection Yusuke Hayashi, Rikuu Hasegawa, Takuya Wadatsumi, Kazuki Monta, Takuji Miki, Makoto Nagata (Kobe Univ.) VLD2023-64 ICD2023-72 DC2023-71 RECONF2023-67 |
Lasers have been the leading method of fault injection in fault injection attacks on cryptographic integrated circuit (I... [more] |
VLD2023-64 ICD2023-72 DC2023-71 RECONF2023-67 pp.178-181 |
ICD, HWS |
2023-10-31 15:00 |
Mie |
(Primary: On-site, Secondary: Online) |
Side-Channel Leakage Evaluation of 3D CMOS Chip Stacking Kazuki Monta, Rikuu Hasegawa, Takuji Miki, Makoto Nagata (Kobe Univ.) HWS2023-57 ICD2023-36 |
2.5D and 3D packaging are methodologies that include multiple integrated circuit (IC) chips. They deliver enhanced perfo... [more] |
HWS2023-57 ICD2023-36 pp.16-19 |
HWS |
2023-04-14 14:45 |
Oita |
(Primary: On-site, Secondary: Online) |
Exploration of analysis methods of electromagnetic fault injection attacks on cryptographic IC chips Yusuke Hayashi, Rikuu Hasegawa, Takuya Wadatsumi, Kazuki Monta, Takuji Miki, Makoto Nagata (Kobe Univ.) HWS2023-4 |
There are various methods of fault injection attacks on cryptographic IC chips, such as lasers and electromagnetic waves... [more] |
HWS2023-4 pp.11-15 |
HWS |
2023-04-14 15:10 |
Oita |
(Primary: On-site, Secondary: Online) |
Electromagnetic fault injection attacks on cryptographic IC chips and analysis of internal voltage fluctuation Rikuu Hasegawa, Takuya Wadatsumi, Kazuki Monta, Takuji Miki, Makoto Nagata (Kobe Univ) HWS2023-5 |
Cryptographic IC chips are subject to the threat of fault injection attacks, which cause circuit malfunctions through in... [more] |
HWS2023-5 pp.16-19 |
HWS, ICD |
2022-10-25 10:50 |
Shiga |
(Primary: On-site, Secondary: Online) |
Power current simulation and side channel leakage evaluation of cryptographic IC chips Rikuu Hasegawa, Takuya Wadatsumi, Kazuki Monta, Takuji Miki, Makoto Nagata (Kobe Univ.) HWS2022-32 ICD2022-24 |
Cryptographic modules are threatened by side-channel attacks that use side-channel information to decrypt internal confi... [more] |
HWS2022-32 ICD2022-24 pp.12-16 |
ICD, SDM, ITE-IST [detail] |
2022-08-08 15:20 |
Online |
|
Evaluation of IC Chip Response by Backside Voltage Disturbance in Flip Chip Packaging Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.) SDM2022-40 ICD2022-8 |
Flip chip packaging has become a general technique for mounting semiconductor ICs due to the need for smaller area. Howe... [more] |
SDM2022-40 ICD2022-8 pp.27-30 |