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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 9 of 9  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
VLD, HWS, ICD 2024-02-29
12:05
Okinawa
(Primary: On-site, Secondary: Online)

Shuhei Yokota, Rikuu Hasegawa, Kazuki Monta, Takaki Okidono, Takuji Miki, Makoto Nagata (Kobe Univercity) VLD2023-112 HWS2023-72 ICD2023-101
With the rapid development of electronic technology, the level of integration of electronic devices is clearly on the ri... [more] VLD2023-112 HWS2023-72 ICD2023-101
pp.77-82
VLD, HWS, ICD 2024-03-01
11:15
Okinawa
(Primary: On-site, Secondary: Online)
Investigation of electromagnetic irradiation noise reduction by on-chip LDOs
Rikuu Hasegawa, Kazuki Monta, Takuya Wadatsumi, Takuji Miki, Makoto Nagata (Kobe Univ.) VLD2023-124 HWS2023-84 ICD2023-113
IC chips are subject to the threat of fault injection attacks, which cause circuit malfunctions (faults) by injecting il... [more] VLD2023-124 HWS2023-84 ICD2023-113
pp.131-134
VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] 2023-11-17
09:35
Kumamoto Civic Auditorium Sears Home Yume Hall
(Primary: On-site, Secondary: Online)
Backside Side-Channel Attack by Silicon Substrate Voltage and Simulation
Rikuu Hasegawa, Kazuki Monta, Takuya Watatsumi, Takuji Miki, Makoto Nagata (Kobe Univ) VLD2023-63 ICD2023-71 DC2023-70 RECONF2023-66
Integrated circuit (IC) chips equipped with cryptographic circuits are vulnerable to side-channel attacks, which use exp... [more] VLD2023-63 ICD2023-71 DC2023-70 RECONF2023-66
pp.173-177
VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] 2023-11-17
10:00
Kumamoto Civic Auditorium Sears Home Yume Hall
(Primary: On-site, Secondary: Online)
Derivation of secret keys by differential fault analysis using backside voltage fault injection
Yusuke Hayashi, Rikuu Hasegawa, Takuya Wadatsumi, Kazuki Monta, Takuji Miki, Makoto Nagata (Kobe Univ.) VLD2023-64 ICD2023-72 DC2023-71 RECONF2023-67
Lasers have been the leading method of fault injection in fault injection attacks on cryptographic integrated circuit (I... [more] VLD2023-64 ICD2023-72 DC2023-71 RECONF2023-67
pp.178-181
ICD, HWS 2023-10-31
15:00
Mie  
(Primary: On-site, Secondary: Online)
Side-Channel Leakage Evaluation of 3D CMOS Chip Stacking
Kazuki Monta, Rikuu Hasegawa, Takuji Miki, Makoto Nagata (Kobe Univ.) HWS2023-57 ICD2023-36
2.5D and 3D packaging are methodologies that include multiple integrated circuit (IC) chips. They deliver enhanced perfo... [more] HWS2023-57 ICD2023-36
pp.16-19
HWS 2023-04-14
14:45
Oita
(Primary: On-site, Secondary: Online)
Exploration of analysis methods of electromagnetic fault injection attacks on cryptographic IC chips
Yusuke Hayashi, Rikuu Hasegawa, Takuya Wadatsumi, Kazuki Monta, Takuji Miki, Makoto Nagata (Kobe Univ.) HWS2023-4
There are various methods of fault injection attacks on cryptographic IC chips, such as lasers and electromagnetic waves... [more] HWS2023-4
pp.11-15
HWS 2023-04-14
15:10
Oita
(Primary: On-site, Secondary: Online)
Electromagnetic fault injection attacks on cryptographic IC chips and analysis of internal voltage fluctuation
Rikuu Hasegawa, Takuya Wadatsumi, Kazuki Monta, Takuji Miki, Makoto Nagata (Kobe Univ) HWS2023-5
Cryptographic IC chips are subject to the threat of fault injection attacks, which cause circuit malfunctions through in... [more] HWS2023-5
pp.16-19
HWS, ICD 2022-10-25
10:50
Shiga
(Primary: On-site, Secondary: Online)
Power current simulation and side channel leakage evaluation of cryptographic IC chips
Rikuu Hasegawa, Takuya Wadatsumi, Kazuki Monta, Takuji Miki, Makoto Nagata (Kobe Univ.) HWS2022-32 ICD2022-24
Cryptographic modules are threatened by side-channel attacks that use side-channel information to decrypt internal confi... [more] HWS2022-32 ICD2022-24
pp.12-16
ICD, SDM, ITE-IST [detail] 2022-08-08
15:20
Online   Evaluation of IC Chip Response by Backside Voltage Disturbance in Flip Chip Packaging
Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.) SDM2022-40 ICD2022-8
Flip chip packaging has become a general technique for mounting semiconductor ICs due to the need for smaller area. Howe... [more] SDM2022-40 ICD2022-8
pp.27-30
 Results 1 - 9 of 9  /   
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