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CPM, ICD 2008-01-18
14:15		 Tokyo Kikai-Shinko-Kaikan Bldg Assessment Test for Solder Joint Reliability in Mobile Products
Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155		 When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic ... [more] CPM2007-144 ICD2007-155
pp.93-98
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