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Committee Date Time Place Paper Title / Authors Abstract Paper #
EMD, R 2009-02-20
Mie Sumitomo Wiring Systems LTD., Head Office Pull strength analysis of Pb free solder at a connected point
Taku Hashiguchi, Yuta Nasukawa, Kazunori Hiraoka (Salesian Polytecn.) R2008-51 EMD2008-127
Pull strength of Pb free solder at a connected point is tested and analyzed.
Experiments are performed with various p... [more]
R2008-51 EMD2008-127
CPM, ICD 2008-01-18
Tokyo Kikai-Shinko-Kaikan Bldg Assessment Test for Solder Joint Reliability in Mobile Products
Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155
When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic ... [more] CPM2007-144 ICD2007-155
CPM, ICD 2008-01-18
Tokyo Kikai-Shinko-Kaikan Bldg Reliability evaluation of lead free solder joint against vibration load under thermal circumstance
Michiya Matsushima (Osaka Univ.), Toshiyuki Hamano (ESPEC), Kiyokazu Yasuda, Kozo Fujimoto (Osaka Univ.) CPM2007-148 ICD2007-159
The reliability of electronics solder joints is evaluated for each individual stress even if the electronics devices are... [more] CPM2007-148 ICD2007-159
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