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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
EMD 2015-11-06
11:25
Miyagi Tohoku University, School of engineering, Aoba memorial hall Magnetic Pulse Spot Welding of Flexible Printed Circuits
Tomokatsu Aizawa (Tokyo Metropolitan College), Yoshitaka Sugiyama (Yazaki Corporation), Mehrdad Kashani (Tokyo Metropolitan College), Kenichi Hanazaki (Yazaki Corporation) EMD2015-78
This paper describes a novel spot welding technique for overlapped copper foils of flexible printed circuits (FPC) and i... [more] EMD2015-78
pp.63-66
EMD 2007-12-21
15:55
Tokyo Japan Aviation Electronics Industry,Limited Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards (2nd Report)
Tomokatsu Aizawa (Tokyo Metropolitan College), Kenichi Hanazaki (Yazaki Corporation), Keigo Okagawa (Tokyo Metropolitan College) EMD2007-106
This paper describes a new welding technique for copper foils on
flexible printed circuit boards and its experimental r... [more]
EMD2007-106
pp.35-38
EMD 2006-11-17
15:30
Kanagawa Fujitsu Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards
Tomokatsu Aizawa (College of Industrial Tech.), Kenichi Hanazaki (Yazaki Corporation), Keigo Okagawa (College of Industrial Tech.)
This paper describes a new welding technique for copper foils on flexible printed circuit boards and its experimental re... [more] EMD2006-57
pp.17-20
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