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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 5 of 5  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
CPM 2023-07-31
14:40		 Hokkaido
(Primary: On-site, Secondary: Online)		 Evaluation of VUV Absorption Characteristics in Surface Modification of Dielectric Resin Materials by VUV Light
Shinichi Endo, Yuki Ishikawa (Osaka Prefecture University), Hina Shirakashi, Takeyasu Saito (Osaka Metropolitan univ.) CPM2023-13		 Since resin generally absorbs vacuum ultraviolet (VUV) light well, it is thought that the VUV light reaching the inside ... [more] CPM2023-13
pp.7-10
CPM 2023-08-01
09:15		 Hokkaido
(Primary: On-site, Secondary: Online)		 The effect of surface modified epoxy-type resin by UV irradiation
Takeyasu Saito, Hina Shirakashi, Takumi Nishiura (Osaka Metropolitan Univ.), Shinichi Endo (Osaka Metropolitan Univ./Ushio Inc.), Yuki Ishikawa (Osaka Metropolitan Univ./SANYU REC.LTD.), Naoki Okamoto (Osaka Metropolitan Univ.) CPM2023-18		  [more] CPM2023-18
pp.25-28
CPM 2023-08-01
10:05		 Hokkaido
(Primary: On-site, Secondary: Online)		 Evaluation of the Physical Properties of Reactive sputtered Ti or V-based MAX alloy thin film
Kazuki Ueda, Kazunobu Wkamatsu, Takeyasu Saito, Naoki Okamoto (Osaka Metropolitan Univ.) CPM2023-20		 Currently, Cu is the main wiring material in leading-edge semiconductor devices. However, since Cu easily diffuses into ... [more] CPM2023-20
pp.33-35
CPM 2019-08-26
15:25		 Hokkaido Kitami Institute of Technology Preparation and semiconductor properties of anthracene doped ZIF-8
Hatsunori Kashima, Shota Shimizu, Naoki Okamoto, Takeyasu Saito (Osaka Pref Univ.) CPM2019-41		 Metal Organic Framework (MOF) has recently attracted much attention in electronics due to its following characteristic: ... [more] CPM2019-41
pp.19-22
SDM 2012-03-05
14:00		 Tokyo Kikai-Shinko-Kaikan Bldg. Evaluation of additives effects in copper electroplating solution by rapid exchange using microfluidic reactor
Takeyasu Saito, Yutaka Miyamoto, Sunao Hattori, Naoki Okamoto, Kazuo Kondo (Osaka Prefecture Univ.) SDM2011-181		 The adsorption behaviour of additives during copper electrodeposition was investigated by the microfluidic reactor. We ... [more] SDM2011-181
pp.31-35
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