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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SDM |
2016-01-22 10:05 |
Tokyo |
Sanjo Conference Hall, The University of Tokyo |
[Invited Talk]
Reliability Results of 4 million Micro Bump Interconnections of 3D Stacked 16 M Pixel Image Sensor Yoshiaki Takemoto, Naohiro Takazawa, Mitsuhiro Tsukimura, Haruhisa Saito, Toru Kondo, Hideki Kato, Jun Aoki, Kenji Kobayashi, Shunsuke Suzuki, Yuichi Gomi, Seisuke Matsuda, Yoshitaka Tadaki (Olympus) SDM2015-108 |
We evaluated the reliability of 3D stacked CMOS image sensors (CISs) with 4 million micro bump inter-connections at a 7.... [more] |
SDM2015-108 pp.1-4 |
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