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All Technical Committee Conferences (Searched in: Recent 10 Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
EE, IEE-HCA |
2021-05-27 09:00 |
Online |
Online |
A Power Semiconductor Device Characterization Technique with Deep Learning Image Processing Kosuke Matsumoto, Yoichi Isizuka (Nagasaki Univ.), Noritaka Shigei (Kagoshima Univ.), Takahiro Koga (ANSYS) EE2021-1 |
With the diversification of development themes in the power electronics field, rework in the manufacturing process has b... [more] |
EE2021-1 pp.1-6 |
EE, IEE-SPC (Joint) |
2020-03-05 14:06 |
Nagasaki |
(Cancelled but technical report was issued) |
A Consideration of Loss Analysis Method for Magnetic Transformer in LLC DC-DC Converter Fumiya Shiraishi, Fumiya Iwasaki, Yuichi Yokoi (Nagasaki Univ.), Takahiro Koga (ANSYS), Yoichi Ishizuka (Nagasaki Univ.) EE2019-77 |
LLC DC-DC converters can achieve high power density and high power efficiency, and are used in many applications. The po... [more] |
EE2019-77 pp.13-18 |
HWS, VLD [detail] |
2020-03-07 13:25 |
Okinawa |
Okinawa Ken Seinen Kaikan (Cancelled but technical report was issued) |
Side-channel leakage evaluation of cryptographic module by IC chip level power supply noise simulation Kazuki Yasuda, Kazuki Monta, Akihiro Tsukioka, Noriyuki Miura, Makoto Nagata (Kobe Univ), Karthik Srinivasan, Shan Wan, Lagn Lin, Ying-Shiun Li, Norman Chang (ANSYS) VLD2019-142 HWS2019-115 |
In this research, we focused on power supply noise as one of the observed side channel information leakage in cryptograp... [more] |
VLD2019-142 HWS2019-115 pp.279-282 |
HWS, ICD [detail] |
2019-11-01 14:55 |
Osaka |
DNP Namba SS Bld. |
Countermeasures for power noise and side-channel leakage in crypto modules (Ⅱ) Kazuki Monta, Akihiro Tsukioka, Daichi Nakagawa, Kazuki Yasuoka, Noriyuki Miura, Makoto Nagata (Kobe Univ.), Karthik Srinivasan, Shan Wan, Lang Lin, Ying-Siun Li, Norman Chang (ANSYS) HWS2019-61 ICD2019-22 |
[more] |
HWS2019-61 ICD2019-22 pp.25-28 |
VLD, DC, CPSY, RECONF, CPM, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC (Joint) [detail] |
2017-11-07 14:55 |
Kumamoto |
Kumamoto-Kenminkouryukan Parea |
Simulation Techniques for EMC Compliant Design of Automotive IC Chips and Modules Akihiro Tsukioka, Makoto Nagata, Kohki Taniguchi, Daisuke Fujimoto (Kobe Univ.), Rieko Akimoto, Takao Egami, Kenji Niinomi, Takeshi Yuhara, Sachio Hayashi (TOSHIBA), Rob Mathews, Karthik Srinivasan, Ying-Shiun Li, Norman Chang (ANSYS) CPM2017-84 ICD2017-43 IE2017-69 |
In recent years, electromagnetic compatibility (EMC) becomes a major concern among IC chips. EMC is characterized in two... [more] |
CPM2017-84 ICD2017-43 IE2017-69 pp.27-32 |
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