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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 9 of 9  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
R 2020-11-30
Online Online Verification of effect by comparison of temperature cycle test and thermal shock test
Yuri Saito, Matsuguma Osamu, Aoki Yuichi (ESPEC) R2020-26
(To be available after the conference date) [more] R2020-26
R 2017-11-16
Osaka   Effects on Stresses in HALT
Raphael Pihet, Takuya Hirata, Hideki Kawai, Aoki Yuichi (ESPEC) R2017-53
HALT (Highly Accelerated Limit Test) is an accelerated test which, by applying severe stresses, can identify the relativ... [more] R2017-53
R 2012-11-15
Osaka   The safety and evaluation test of Lithium-Ion Secondary Battery
Manabu Okamoto, Hideki Kawai, Arata Okuyama, Yuichi Aoki (Espec Corp.) R2012-65
In a lithium-ion secondary battery, this report describes the principle and the subject of safety. The outline of the sa... [more] R2012-65
R 2011-11-18
Osaka   Temperature Humidity Test of Silver-Epoxy Isotropic Conductive Adhesive
Takuya Hirata, Yuichi Aoki (ESPEC CORP.) R2011-35
To evaluate the reliability test condition for Isotropic Conductive Adhesive (ICA), we curried out various temperature h... [more] R2011-35
R 2010-11-19
Osaka   Performance Degradation of Photovoltaic Modules with Rapid Thermal-Cycling
Yuichi Aoki, Manabu Okamoto (Espec Corp.), Atsushi Masuda, Takuya Doi (AIST) R2010-33
To clarify the failure-mode of crystalline-silicon photovoltaic modules on the thermal-cycle test, the modules were expo... [more] R2010-33
EMD, R 2009-02-20
Mie Sumitomo Wiring Systems LTD., Head Office Evaluation of electric contact trouble caused by silicone. -- Evaluation test with new environmental examination device --
Makito Morii, Hiroyuki Moriwaki (OMRON), Hideki Tanaka, Yoshitaka Ueki, Kenji Suzuki, Kimio Yoshizumi, Masanobu Nishikawa (espec) R2008-52 EMD2008-128
The phenomenon of the point of contact's becoming a loose connection with the gas generated from the compound of the org... [more] R2008-52 EMD2008-128
CPM, ICD 2008-01-18
Tokyo Kikai-Shinko-Kaikan Bldg Reliability evaluation of lead free solder joint against vibration load under thermal circumstance
Michiya Matsushima (Osaka Univ.), Toshiyuki Hamano (ESPEC), Kiyokazu Yasuda, Kozo Fujimoto (Osaka Univ.) CPM2007-148 ICD2007-159
The reliability of electronics solder joints is evaluated for each individual stress even if the electronics devices are... [more] CPM2007-148 ICD2007-159
PRMU, MI 2006-05-26
Aichi Aichi Prefectural University Development of Integrated Calibration Assistant Tool for Pixel-PSPMT Type Gamma Camera
Toshio Modegi, Shin-ichiro Koyasu (DNP), Hiroyuki Mashino (Espec), Seiichi Yamamoto (KCCT), Hidehiro Iida (NCVC)
We are developing small animal PET/ SPECT scanner systems and high-definition small pixel-PSPMT type gamma cameras for t... [more] PRMU2006-29 MI2006-29
OPE, R, CPM 2005-04-22
Tokyo Kikai-Shinko-Kaikan Bldg. Study of accelerate test method for Optical components
Yuichi Aoki, Yasutoshi Nakagawa (ESPEC)
We performed the HAST for adhesive of optical components to compared with High temperature & High humidity test such as ... [more] R2005-4 CPM2005-4 OPE2005-4
 Results 1 - 9 of 9  /   
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