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All Technical Committee Conferences (Searched in: All Years)
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| Search Results: Conference Papers |
| Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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| Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
| HWS, VLD |
2023-03-01
11:25 |
Okinawa |
(Primary: On-site, Secondary: Online) |
Pass/Fail Threshold Determination Based on Gaussian Process Regression in LSI Test
Daisuke Goeda (KIT), Tomoki Nakamura, Masuo Kajiyama, Makoto Eiki (SCK), Michihiro Shintani (KIT)  VLD2022-74 HWS2022-45 |
[more] |
VLD2022-74 HWS2022-45
pp.7-12 |
| HWS, VLD |
2023-03-02
13:25 |
Okinawa |
(Primary: On-site, Secondary: Online) |
[Memorial Lecture]
Wafer-Level Characteristic Variation Modeling Considering Systematic Discontinuous Effects
Takuma Nagao (NAIST), Tomoki Nakamura, Masuo Kajiyama, Makoto Eiki (Sony Semiconductor Manufacturing), Michiko Inoue (NAIST), Michihiro Shintani (Kyoto Institute of Technology) VLD2022-91 HWS2022-62 |
Statistical wafer-level variation modeling is an attractive method for reducing the measurement cost in large-scale inte... [more] |
VLD2022-91 HWS2022-62
p.109 |
| ICD, SDM, ITE-IST [detail] |
2022-08-08
09:15 |
Online |
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[Invited Talk]
A 2-Layer Transistor Pixel Stacked CMOS Image Sensor with Oxide Based Full Trench Isolation for Large Full Well Capacity and High Quantum Efficiency
Koichiro Zaitsu, Akira Matsumoto, Mizuki Nishida, Yusuke Tanaka, Hirofumi Yamashita, Yosuke Satake (Sony Semiconductor Solutions), Takashi Watanabe, Kunihiko Araki, Naoki Nei (Sony Semiconductor Manufacturing), Keiichi Nakazawa, Junpei Yamamoto, Mutsuo Uehara (Sony Semiconductor Solutions), Hiroyuki Kawashima, Yusaku Kobayashi (Sony Semiconductor Manufacturing), Tomoyuki Hirano, Keiji Tatani (Sony Semiconductor Solutions) SDM2022-33 ICD2022-1 |
(To be available after the conference date) [more] |
SDM2022-33 ICD2022-1
pp.1-6 |
| ICD, SDM, ITE-IST [detail] |
2022-08-08
10:00 |
Online |
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[Invited Talk]
Low-Noise Multi-Gate Pixel Transistor for Sub-Micron Pixel CMOS Image Sensors
Naohiko Kimizuka, Shota Kitamura, Akiko Honjo, Koichi Baba, Toshihiro Kurobe, Hideomi Kumano, Takuya Toyohuku (Sony Semiconductor Solutions), Kouhei Takeuchi, Shota Nishimura (Sony Semiconductor Manufacturing), Akihiko Kato, Tomoyuki Hirano, Yusuke Oike (Sony Semiconductor Solutions) SDM2022-34 ICD2022-2 |
The pixel size of CMOS image sensor (CIS) continues to be rapidly decreasing due to strong demand from mobile applicatio... [more] |
SDM2022-34 ICD2022-2
p.7 |
| VLD, HWS [detail] |
2022-03-08
09:55 |
Online |
Online |
Wafer-Level Characteristic Variation Modeling with Considering Discontinuous Effect Caused by Manufacturing Equipment
Takuma Nagao (National Institute of Technology (KOSEN)), Michihiro Shintani (Nara Institute of Science and Technology), Ken'ichi Yamaguchi, Hiroshi Iwata (National Institute of Technology (KOSEN)), Tomoki Nakamura, Masuo Kajiyama, Makoto Eiki (SCK), Michiko Inoue (Nara Institute of Science and Technology) VLD2021-92 HWS2021-69 |
Statistical methods for predicting the performance of large-scale integrated circuits (LSIs) manufactured on a wafer are... [more] |
VLD2021-92 HWS2021-69
pp.87-92 |
| ICD |
2017-04-21
14:15 |
Tokyo |
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[Invited Talk]
A 1/2.3in 20Mpixel 3-Layer Stacked CMOS Image Sensor with DRAM
Tsutomu Haruta, Tsutomu Nakajima, Jun Hashizume, Taku Umebayashi, Hiroshi Takahashi, Kazuo Taniguchi, Masami Kuroda, Hiroshi Sumihiro, Koji Enoki (Sony Semiconductor Solutions), Takatsugu Yamasaki (Sony Semiconductor Manufacturing), Katsuya Ikezawa, Atsushi Kitahara, Masao Zen, Masafumi Oyama, Hiroki Koga (Sony Semiconductor Solutions) ICD2017-18 |
[more] |
ICD2017-18
pp.95-98 |
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