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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
EE, IEE-SPC |
2010-07-30 16:05 |
Kochi |
Kochi National College of Technology |
Frequency Domain Analysis of Fixed On-Time with Bottom Detection Controlled Converter Toshiyuki Zaitsu (TI Japan), Terukazu Sato, Takashi Nabeshima (Oita Univ.) EE2010-15 |
[more] |
EE2010-15 pp.117-120 |
CPM, ICD |
2008-01-18 14:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
Assessment Test for Solder Joint Reliability in Mobile Products Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155 |
When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic ... [more] |
CPM2007-144 ICD2007-155 pp.93-98 |
SIP, ICD, IE, IPSJ-SLDM (Joint) [detail] |
2007-10-25 15:15 |
Fukushima |
Aidu-Higasiyama-Onsen Kuturogijuku |
[Invited Talk]
Present situation and future perspective of video codec using DSP Tomoyuki Naito (TI Japan) |
[more] |
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ICD, CPM |
2007-01-19 09:50 |
Tokyo |
Kika-Shinko-Kaikan Bldg. |
Modeling of Wire Bonding Process for High Performance Device Eiichi Yamada, Masazumi Amagai (TI Japan) |
[more] |
CPM2006-143 ICD2006-185 pp.83-86 |
ICD, CPM |
2005-09-08 13:50 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The Study of Silicon Stress for Stacked Die Packages Kenji Abe, Eiichi Yamada, Yutaka Suzuki, Masazumi Amagai (TI Japan) |
[more] |
CPM2005-92 ICD2005-102 pp.41-44 |
ICD, CPM |
2005-09-08 14:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The Study of Stress Sensor for Stacked Die Packages Yutaka Suzuki, Kenji Abe, Eiichi Yamada, , Masazumi Amagai (TI Japan) |
[more] |
CPM2005-93 ICD2005-103 pp.45-48 |
ICD |
2005-07-14 14:15 |
Aichi |
Toyohashi Univ. of Tech. |
* (TI Japan), Shigetoshi Sugawa (Tohoku Univ.), (TI Japan), Nana Akahane (Tohoku Univ.), , (TI Japan) |
[more] |
ICD2005-48 pp.49-53 |
ICD, CPM |
2005-01-27 16:45 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The Study of An-Ag-X Lead Free Solders for High Reliability Masazumi Amagai (TI Japan), Tsukasa Ohnishi, (SMI) |
[more] |
CPM2004-161 ICD2004-206 pp.35-38 |
IE, SIP, ICD, IPSJ-SLDM |
2004-10-22 14:15 |
Yamagata |
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A class-D amplifier using a spectrum shaping technique Akira Yasuda (Hosei Univ.), Takashi Kimura, Koichiro Ochiai, Toshihiko Hamasaki (TI Japan) |
In this paper, we propose a new class-D amplifier with a lower-frequency reference signal by using a spectrum shap-ing t... [more] |
SIP2004-98 ICD2004-130 IE2004-74 pp.55-60 |
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