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All Technical Committee Conferences (Searched in: All Years)
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Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
ICD, SDM, ITE-IST [detail] |
2022-08-08 15:20 |
Online |
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Evaluation of IC Chip Response by Backside Voltage Disturbance in Flip Chip Packaging Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.) SDM2022-40 ICD2022-8 |
Flip chip packaging has become a general technique for mounting semiconductor ICs due to the need for smaller area. Howe... [more] |
SDM2022-40 ICD2022-8 pp.27-30 |
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