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Committee Date Time Place Paper Title / Authors Abstract Paper #
ICD, SDM, ITE-IST [detail] 2022-08-08
15:20
Online   Evaluation of IC Chip Response by Backside Voltage Disturbance in Flip Chip Packaging
Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.) SDM2022-40 ICD2022-8
Flip chip packaging has become a general technique for mounting semiconductor ICs due to the need for smaller area. Howe... [more] SDM2022-40 ICD2022-8
pp.27-30
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