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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2016-01-22
16:00
Tokyo Sanjo Conference Hall, The University of Tokyo [Invited Talk] Packaging Material for 2.5D/3D TSV Integration
Kazuyuki Mitsukura, Tatsuya Makino, Keiichi Hatakeyama (Hitachi Chemical), Kenneth June Rebibis, Andy Miller, Eric Beyne (IMEC) SDM2015-118
 [more] SDM2015-118
pp.45-47
ICD, SDM 2012-08-02
14:40
Hokkaido Sapporo Center for Gender Equality, Sapporo, Hokkaido Intra/Inter Tier Substrate Noise Measurements in 3D ICs
Yasumasa Takagi, Yuuki Araga, Makoto Nagata (Kobe Univ.), Geert Van der Plas, Jaemin Kim, Nikolaos Minas, Pol Marchal, Michael Libois, Antonio La Manna, Wenqi Zhang, Julien Ryckaert, Eric Beyne (IMEC) SDM2012-72 ICD2012-40
Substrate noise propagation among stacked dice is evaluated in a 3D test vehicle of 2 tier stacking. Each tier incorpora... [more] SDM2012-72 ICD2012-40
pp.49-54
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