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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 9 of 9  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2025-02-19
13:20		 Tokyo Tokyo Univ. Hongo Engineering/Building4-Room43 (Tokyo, Online)
(Primary: On-site, Secondary: Online)		 [Invited Talk] Surface Topography Control for Polymer/Cu Hybrid Bonding
Yuzo Nakamura (YNU/MCI), Yusuke Kondo, Kenta Hayama, Fabiana Lie Tanaka, Fumihiro Inoue (YNU) 		 [more]
SDM 2025-02-19
14:40		 Tokyo Tokyo Univ. Hongo Engineering/Building4-Room43 (Tokyo, Online)
(Primary: On-site, Secondary: Online)		 [Invited Talk] D2W Hybrid Bonding System Achieving High Accuracy and High Throughput With Minimal Configurations
Mihara Kentaro, Hare Takashi, Miyoshi Takayuki, Hirofumi Sakai, Aoki Shimpei, Toyoharu Terada (TRENG), Hiroyuki Hashimoto, Mariappan Murugesan, Hisashi Kino, Tetsu Tanaka, Takafumi Fukushima (TU), Fumihiro Inoue (YNU), Akira Uedono (UT) 		 [more]
ET 2015-03-14
15:40		 Tokushima Shikoku Univ. Plaza (Tokushima) Establishment of an Active Engineering Learning Center on the basis of a Visualization
Hideaki Okazaki, Fumihiro Inoue (Shonan Inst. Tech.), Michiya Inoue (Tokyo D Univ), Fumio Ozaki, Toshiaki Kagawa, Hiroyuki Sato, Hiroshi Takahashi, Toshihiro Tachibana, Kaya Nagasawa, Hiroshi Ninomiya, Takako Nonaka, Hikaru Mizutani (Shonan Inst. Tech.) ET2014-93		 We show an establishment of an active engineering learning center on the basis of a visualization, and especially presen... [more] ET2014-93
pp.45-49
RCS, SR, SRW
(Joint)		 2015-03-05
10:20		 Tokyo Tokyo Institute of Technology (Tokyo) Proposal of coexistence scheme for wireless LAN and multiple wireless PANs
Fumihiro Inoue, Takayuki Nishio, Masahiro Morikura, Koji Yamamoto (Kyoto Univ.), Daisuke Murayama, Takatoshi Sugiyama (NTT) SRW2014-51		 To operate IEEE 802.11g based wireless LANs (WLANs) and IEEE 802.15.4 based wireless personal area networks (WPANs) in t... [more] SRW2014-51
pp.25-30
SRW 2013-12-16
13:50		 Tokyo Kikai-Shinko-Kaikan Bldg (Tokyo) A coexistence scheme for wireless LAN and multiple wireless PANs
Fumihiro Inoue, Takayuki Nishio, Masahiro Morikura, Koji Yamamoto (Kyoto Univ.), Fusao Nuno, Takatoshi Sugiyama (NTT) SRW2013-40		 To operate IEEE 802.11g based wireless LANs (WLANs) and IEEE 802.15.4 based wireless personal area networks (WPANs) in t... [more] SRW2013-40
pp.13-18
ASN, IPSJ-UBI 2013-05-16
16:40		 Kumamoto Kumamoto University (Kumamoto) [Poster Presentation] Coexistence scheme of Wireless LAN and Wireless Sensor Network Employing Priority Control
Fumihiro Inoue, Masahiro Morikura, Koji Yamamoto (Kyoto Univ.), Fusao Nuno, Takatoshi Sugiyama (NTT) ASN2013-15		 To operate IEEE 802.11g based wireless LANs (WLANs) and IEEE 802.15.4 based wireless sensor networks (WSNs) in the same ... [more] ASN2013-15
pp.79-84
SDM 2013-02-04
16:05		 Tokyo Kikai-Shinko-Kaikan Bldg. (Tokyo) Novel Seed Layer Formation Using Electroless Copper Deposition For High Aspect Ratio TSV
Fumihiro Inoue, Shoso Shingubara (Kansai Univ.), Harold Philipsen (IMEC) SDM2012-156		  [more] SDM2012-156
pp.31-34
SDM 2012-03-05
14:55		 Tokyo Kikai-Shinko-Kaikan Bldg. (Tokyo) Formation of conformal barrier layer by electroless plating for TSV of 3D-LSI
Ryohei Arima, Hiroshi Miyake, Fumihiro Inoue, Tomohiro Shimizu, Shoso Shingubara (Kansai Univ.) SDM2011-182		 Conformal deposition of barrier metal layer in a high aspect ratio TSV using electroless plating with precious metal nan... [more] SDM2011-182
pp.37-40
ED 2009-07-31
11:15		 Osaka Osaka Univ. Icho-Kaikan (Osaka) Study of Electroless Copper Plating for Through Si Via Filling
Fumihiro Inoue, Takumi Yokoyama (Kansai Univ.), Kazuhiro Yamamoto, Shukichi Tanaka (NiCT), Shoso Shingubara (Kansai Univ.) ED2009-111		 In recent studies, The formation of through-Silicon via hole (TSV) which stacks multiple layers of thin Si substrates is... [more] ED2009-111
pp.47-50
 Results 1 - 9 of 9  /   
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