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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| WPT, MW | 2023-04-13 14:45 |
Tokyo | Kikai-Shinko-Kaikan Bldg. (Primary: On-site, Secondary: Online) |
Design and Evaluation of Small 4-way Power Combiner using One Waveguide Yuta Sugiyama, Takeshi Oshima, Hidenori Ishibashi, Miki Kagano, Hidenori Yukawa, Toru Fukasawa, Yoshio Inasawa (Mitsubishi Electric)  WPT2023-4 MW2023-4 |
High power HPAs made of GaN are beginning to be widely used for 5G and satellite communications. Maximum output power of... [more] | WPT2023-4 MW2023-4 pp.16-21 |
| MW | 2022-03-03 09:35 |
Online | Online | Chip Resistors for Heat Dissipation on RF circuits Yuta Sugiyama, Hidenori Ishibashi, Takeshi Oshima, Hidenori Yukawa, Toru Fukasawa, Toru Takahashi, Yoshio Inasawa (Mitsubishi Electric) MW2021-112 |
In this paper we present that the technology of heat dissipation for RF circuit using chip resistors. The quarter wavele... [more] | MW2021-112 pp.7-11 |
| MW | 2021-11-18 13:05 |
Kagoshima | Kagoshima University (Primary: On-site, Secondary: Online) |
4-way Power Combiner Including Board-to-Board Transition Using Spring Contact Probes Takuma Nishimura, Hidenori Ishibashi, Yutarou Yamaguchi, Takumi Nagamine, Hidenori Yukawa, Toru Fukasawa, Yoshio Inasawa (MELCO) MW2021-66 |
Conventional SSPA has a method of synthesizing power by mounting multiple MMIC on the board with flip-chip bonding for h... [more] | MW2021-66 pp.1-6 |
| MW | 2021-03-05 15:20 |
Online | Online | RF circuit combined inkjet-printed silver wire and copper foil wire Yuta Sugiyama, Hidenori Ishibashi, Takeshi Oshima, Toru Takahashi, Yoshio Inasawa (Mitsubishi Electric), Hikaru Harada (Kishu Giken Kogyo) MW2020-99 |
In this paper we present RF circuit combined inkjet-printed silver wiring and copper foil wiring. Since the inkjet print... [more] | MW2020-99 pp.43-48 |
| MW | 2020-06-04 13:35 |
Online | Online | A Study of Termination with Stubs in Resistive Film Hidenori Ishibashi, Yukinobu tarui, Yuko Onodera, Toru Takahashi, Naofumi Yoneda, Moriyasu Miyazaki (Mitsubishi Electric) MW2020-11 |
[more] | MW2020-11 pp.1-4 |
| MW, WPT | 2018-04-27 14:50 |
Tokyo | Kikai-Shinko-Kaikan Building | S-band Tx Module with Cu Pillar Interconnection Si/GaN 3D Chip Embedding Substrate Kengo Kawasaki, Eigo Kuwata, Hidenori Ishibashi, Tomohiro Yao, Kiyoshi Ishida, Kazuhiro Maeda, Hironobu Shibata, Masaomi Tsuru, Kazutomi Mori, Mitsuhiro Shimozawa, Hiroshi Fukumoto (Mitsubishi Electric Corp.) WPT2018-5 MW2018-5 |
A SiGe chip and GaN chip packaged Tx module in S-band is represented. SiGe and GaN with Redistribution Layer (RDL) are i... [more] | WPT2018-5 MW2018-5 pp.19-23 |
| MW | 2017-06-22 14:00 |
Aichi | A-101, Wing-A, Toyohashi University of Technology | An Improvement of Robustness for Vertical Transition Using Spring Contact Probes Hiroyuki Aoyama, Hidenori Ishibashi, Naofumi Yoneda, Naoyuki Yamamoto, Moriyasu Miyazaki (Mitsubishi Electric Corp.) MW2017-21 |
The coaxial connector is commonly used for electrical connection between circuit boards at radio frequency (RF). However... [more] | MW2017-21 pp.1-4 |
| MW | 2017-05-18 15:25 |
Osaka | Osaka Univ. (Seminar Room1, Osaka Univ. Kaikan) | A Multi-layered Substrate Integrated Dual-Input Ring Termination for High Power Handling Capability Takeshi Yuasa, Hidenori Ishibashi, Akihiro Ando, Hironobu Shibata, Ko Kurata, Tetsu Owada, Naofumi Yoneda, Moriyasu Miyazaki (Mitsubishi Electric Co.) MW2017-11 |
[more] | MW2017-11 pp.19-23 |
| AP | 2017-03-16 09:55 |
Iwate | Iwate Univ. | Multi-Band Small Circular Polarized Antenna Composed of Inverted F/L Hiroaki Sakamoto, Takashi Yanagi, Hidenori Ishibashi, Toru Fukasawa, Yasuhiro Nishioka, Hiroaki Miyashita (Mitsubishi Electric) AP2016-178 |
In previous study, we proposed a dual band Quadrifilar Helical Antenna(QHA) that is simple structure applied parallel re... [more] | AP2016-178 pp.5-10 |
| MW, ICD | 2017-03-03 15:00 |
Okayama | Okayama Prefectural Univ. | A Small and Coverless T/R Module with Electromagnetic Shielded Surface Mount Packages Hiroyuki Mizutani, Hidenori Ishibashi, Masatake Hangai, Takanobu Fujiwara, Kenichi Tajima (Mitsubishi Electric) MW2016-214 ICD2016-144 |
Small size and high performance electronic devices are required lately. To prevent a malfunction by an electromagnetic i... [more] | MW2016-214 ICD2016-144 pp.141-144 |
| MW | 2016-05-19 15:25 |
Kyoto | Kyoto Univ. | A Directivity Enhancement for Directional Couplers Using Three-Conductor Coupled Lines Hidehar Yoshioka, Akimichi Hirota, Hidenori Ishibashi, Naofumi Yoneda, Moriyasu Miyazaki (Mitsubishi) MW2016-10 |
In a coupled-line directional coupler formed on thin multi-layered substrates, it is difficult to match coupled-line cha... [more] | MW2016-10 pp.7-10 |
| ICD, MW | 2016-03-02 10:00 |
Hiroshima | Hiroshima University | A Study of Multilayer Printed Wiring Boards Using the Anisotropic Conductive Paste Hidenori Ishibashi (MELCO), Kenji Nagase (MEE), Tetsu Owada, Yoichi Kitamura, Naofumi Yoneda, Hiroaki Miyashita (MELCO) MW2015-173 ICD2015-96 |
In recent years, the resin multilayer wiring boards are used in the radio frequency circuits. They use through hole via ... [more] | MW2015-173 ICD2015-96 pp.1-4 |
| ICD, MW | 2016-03-02 10:25 |
Hiroshima | Hiroshima University | Design and Measurement Results on Vertical Transition Using Spring Contact Probes Hiroyuki Aoyama, Hidenori Ishibashi, Naofumi Yoneda, Satoshi Yamaguchi, Nayuki Yamamoto (MELCO) MW2015-174 ICD2015-97 |
The fitting type connector is commonly used for RF connection between circuit substrates. However, the fitting type conn... [more] | MW2015-174 ICD2015-97 pp.5-8 |
| MW | 2016-01-14 14:45 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | Leadframe Type Semiconductor Packages with Electro-Magnetic Shield Structure Hiroyuki Mizutani, Hidenori Ishibashi, Kiyoshi Ishida, Yousuke Watanabe, Morishige Hieda (Mitsubishi Electric) MW2015-162 |
[more] | MW2015-162 pp.17-20 |
| MW, ICD | 2015-03-06 11:15 |
Fukui | University of Fukui | Reduction of the Phase Deviation for Lumped-element Hybrid Matrix Consists of a Branch-line Hybrid and Rat-race Hybrids Hidenori Ishibashi, Masayuki Hata, Hideki Fushimi, Takeshi Oshima, Yukihiro Tahara, Hiroaki Miyashita (MELCO) MW2014-220 ICD2014-133 |
A hybrid matrix circuit that consists of a 90 degree hybrid and 180 degree hybrids has been proposed as circular interfe... [more] | MW2014-220 ICD2014-133 pp.101-106 |
| MW | 2014-11-20 11:00 |
Nagasaki | Nagasaki Univ. | A Directivity Enhancement for Directional Couplers Using Additional Coupled Lines with Reverse-Phase Forward Couplings Hideharu Yoshioka, Akimichi Hirota, Kazuya Yamamoto, Hidenori Ishibashi, Yukihiro Tahara (Mitsubishi Electric) MW2014-126 |
In a coupled-line directional coupler formed on thin multi-layered substrates, it is difficult to match coupled-line cha... [more] | MW2014-126 pp.17-22 |
| AP | 2014-06-12 14:55 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | A Feed Circuit-integrated 4-Element Array Antenna Using Anisotropic Conductive Paste Shimpei Akimoto, Takashi Yanagi, Toru Fukasawa, Hidenori Ishibashi, Yukihiro Tahara, Tetsu Owada, Hiroaki Miyashita (Mitsubishi Electric) AP2014-45 |
A multifunctional antenna typified by an array antenna is composed of each substrate suitable to an antenna and a feed c... [more] | AP2014-45 pp.29-34 |
| MW | 2014-03-04 11:00 |
Ehime | Ehime University | Waveguide Loop-type Directional Couplers Using a Coupling Conductor with Protuberances Hidenori Ishibashi, Yukihiro Tahara, Hidenori Yukawa (Mitsubishi Electric), Manabu Kurihara (RSEC), Tetsu Owada, Moriyasu Miyazaki (Mitsubishi Electric) MW2013-199 |
The waveguide loop-type directional coupler is mainly used as power monitor of the waveguide circuits. It consists of a ... [more] | MW2013-199 pp.13-18 |
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