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Committee Date Time Place Paper Title / Authors Abstract Paper #
ICD, SDM, ITE-IST [detail] 2022-08-08
Online   Evaluation of IC Chip Response by Backside Voltage Disturbance in Flip Chip Packaging
Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.) SDM2022-40 ICD2022-8
Flip chip packaging has become a general technique for mounting semiconductor ICs due to the need for smaller area. Howe... [more] SDM2022-40 ICD2022-8
Tokyo Tamagawa Univ Construction of Hybrid Authentication System for Voiceprint and Fingerprint
Hikari Kobayashi, Akihiro Tanaka, Satoru Kishida (Tottori Univ.), Toru Watanabe (Matsue National College of Technology), Hiromu Hasegawa (Tottori Univ.) NC2007-183
(To be available after the conference date) [more] NC2007-183
Tokyo Tamagawa Univ Construction of Voiceprint Personal Authentication System with Hierarchical Neural Network
Akihiro Tanaka, Hikari Kobayashi, Satoru Kishida, Hiromu Hasegawa (Tottori Univ.), Toru Watanabe (Matsue National College of Technology) NC2007-184
We constructed an individual authentication system with three-layered neural networks, where voice was used as a biometr... [more] NC2007-184
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