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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 10 of 10  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
MW, WPT 2018-04-27
14:50
Tokyo Kikai-Shinko-Kaikan Building S-band Tx Module with Cu Pillar Interconnection Si/GaN 3D Chip Embedding Substrate
Kengo Kawasaki, Eigo Kuwata, Hidenori Ishibashi, Tomohiro Yao, Kiyoshi Ishida, Kazuhiro Maeda, Hironobu Shibata, Masaomi Tsuru, Kazutomi Mori, Mitsuhiro Shimozawa, Hiroshi Fukumoto (Mitsubishi Electric Corp.) WPT2018-5 MW2018-5
A SiGe chip and GaN chip packaged Tx module in S-band is represented. SiGe and GaN with Redistribution Layer (RDL) are i... [more] WPT2018-5 MW2018-5
pp.19-23
MW, EMCJ, EST, IEE-EMC [detail] 2017-10-20
16:40
Akita Yupopo Demonstration of Uniform Heating Distribution Control for Microwave Heating Small Reactor with Solid-State Oscillators
Kazuhiro Iyomasa, Yoshifumi Kawamura, Ryota Komaru, Yutaro Yamaguchi, Keigo Nakatani, Takeshi Shiode, Koji Yamanaka, Kazutomi Mori, Hiroshi Fukumoto (Melco) EMCJ2017-58 MW2017-110 EST2017-73
(To be available after the conference date) [more] EMCJ2017-58 MW2017-110 EST2017-73
pp.171-175
MW 2016-11-17
14:55
Saga Saga Univ. Industrial microwave heating device using GaN amplifier module
Kazuhiro Iyomasa, Koji Yamanaka, Takeshi Shiode, Hiroyuki Mizutani, Masaomi Tsuru, Yoshifumi Kawamura, Takaaki Yoshioka, Yuji Komatsuzaki, Yutaro Yamaguchi, Keigo Nakatani, Ryuta Komaru, Kazutomi Mori, Hiroshi Fukumoto (Mitsubishi Electric Corp.) MW2016-123
(To be available after the conference date) [more] MW2016-123
pp.39-42
AP, MW
(Joint)
2016-09-16
09:20
Ibaraki AIST 60% PAE, 30W X-band and 33% PAE, 100W Ku-Band PAs utilizing 0.15um GaN HEMT Technology
Takuma Torii, Shohei Imai, Hiroaki Maehara, Tetsuo Kunii, Takuo Morimoto, Norihiro Yunoue, Miyo Miyashita, Miyazaki Yasunori, Tsuyama Yoshinori, Koji Yamanaka, Hiroshi Fukumoto (Mitsubishi Electric Corp.) MW2016-83
 [more] MW2016-83
pp.53-57
EMT, MW, OPE, MWP, EST, IEE-EMT [detail] 2015-07-17
13:25
Hokkaido Kushiro City Lifelong Learning Center Dynamic AM/AM and AM/PM control of Doherty amplifier using tanh-shaped function
Yuji Komatsuzaki, Hiroshi Otsuka, Hifumi Noto, Shintaro Shinjo, Koji Yamanaka, Yoshihiro Hamamatsu, Hiroshi Fukumoto (Mitsubishi Electric Corp.) EMT2015-47 MW2015-85 OPE2015-59 EST2015-51 MWP2015-50
Power amplifiers for communication systems require increasingly high efficiency at large back-off from saturated output ... [more] EMT2015-47 MW2015-85 OPE2015-59 EST2015-51 MWP2015-50
pp.227-232
MW 2015-05-28
13:50
Tokyo The Univ. of Electro-Commun. Large Signal Modeling of GaN-on-Si Transistor for Microwave Heating
Christer M. Andersson, Yutaro Yamaguchi, Kazuhiro Iyomasa, Yoshifumi Kawamura, Shuichi Sakata, Koji Yamanaka, Hiroshi Fukumoto (Mitsubishi Electric) MW2015-21
In this paper, the large signal model of a GaN-on-Si transistor to be employed in microwave heating systems is reported.... [more] MW2015-21
pp.1-5
MW, OPE, EMT, MWP, EST, IEE-EMT [detail] 2014-07-17
10:00
Hokkaido Muroran Inst. of Tech. C-Ku Band Ultra Broadband High Power Reactive Matching MMIC Amplifier using Broadband Interstage Matching Network
Shuichi Sakata, Eigo Kuwata, Koji Yamanaka, Tasuku Kirikoshi, Hidetoshi Koyama, Yoshitaka Kamo, Hiroshi Fukumoto (Mitsubishi Electric) MW2014-53 OPE2014-22 EST2014-14 MWP2014-11
This paper reports on a Gallium Nitride High Electron Mobility Transistor (GaN HEMT) Monolithic Microwave Integrated Cir... [more] MW2014-53 OPE2014-22 EST2014-14 MWP2014-11
pp.1-5
MW, OPE, EMT, MWP, EST, IEE-EMT [detail] 2014-07-17
10:25
Hokkaido Muroran Inst. of Tech. X Band High Power and High Efficiency Amplifier with 2nd Harmoics rejection circuits
Eigo Kuwata, Koji Yamanaka, Shuichi Sakata, Hidetoshi Koyama, Yoshitaka Kamo, Akihiro Ando, Kazuhiko Nakahara, Hiroshi Fukumoto (Mitsubishi Electric) MW2014-54 OPE2014-23 EST2014-15 MWP2014-12
 [more] MW2014-54 OPE2014-23 EST2014-15 MWP2014-12
pp.7-10
MW 2014-03-05
14:20
Ehime Ehime University An X-Band GaN High-Power Amplifier with Input and Output 2nd-harmonic Terminating Networks
Hiromitsu Uchida, Masatake Hangai, Koji Yamanaka, Hiroshi Fukumoto, Nobuhiro Kikuchi, Hidetoshi Koyama, Yoshitaka Kamo (Mitsubishi Electric) MW2013-219
 [more] MW2013-219
pp.129-132
MW 2006-12-22
13:50
Ehime   Millimeter-wave Transmission Line through Silicon Substrate for Solder Seal Package
Takeshi Yuasa, Yukihiro Tahara, Hideyuki Oh-hashi, Shimpei Ogawa, Yoshio Fujii, Hiroshi Fukumoto (Mitsubishi Electric Corp.)
 [more] MW2006-148
pp.23-26
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