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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
US 2011-07-28
11:55
Kyoto Kyoto Electronics Manufacturing Co., Ltd. Brillouin scattering by induced phonon in the GHz range emitted from ZnO piezoelectric thin film
Takeshi Sugimoto, Hiroyuki Sano (Doshisha Univ.), Takahiko Yanagitani (Nagoya Inst. Tech.), Shinji Takayanagi, Mami Matsukawa (Doshisha Univ.) US2011-25
Brillouin scattering is a nondestructive and noncontact technique to measure local longitudinal and shear acoustic veloc... [more] US2011-25
pp.15-19
AI 2010-11-19
15:45
Fukuoka Kyushu Univ. Implementing a Web Page Segmentaion Method Based on a Role of a Content
Hiroyuki Sano, Tatsuya Doi, Shun Shiramatsu, Tadachika Ozono, Toramatsu Shintani (NIT) AI2010-41
Our web page segmentation method divides a web page into Smallest-Blocks, and then assemble some Smallest-Blocks into Co... [more] AI2010-41
pp.61-66
US 2010-09-30
13:25
Miyagi Tohoku Univ. Brillouin scattering from phonons induced by coaxial microwave resonator and ZnO transducer
Hiroyuki Sano (Doshisha Univ.), Takahiko Yanagitani (Nagoya Inst. Tech.), Shinji Takayanagi, Mami Matsukawa (Doshisha Univ.) US2010-66
Brillouin scattering is a nondestructive technique to measure sound velocity propagated in transparent material, using a... [more] US2010-66
pp.99-103
US 2009-09-30
09:25
Hokkaido Noboribetsu Grand Hotel Measurement of in-plane electric properties in a piezoelectric semiconductor by Brillouin scattering method
Takahiko Yanagitani (Nagoya Inst. of Tech.), Hiroyuki Sano, Mami Matsukawa (Doshisha Univ.) US2009-48
Non-contact electric property measurements are required in semiconductor samples to avoid mechanical and chemical damage... [more] US2009-48
pp.59-64
CPM, ICD 2008-01-18
14:15
Tokyo Kikai-Shinko-Kaikan Bldg Assessment Test for Solder Joint Reliability in Mobile Products
Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155
When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic ... [more] CPM2007-144 ICD2007-155
pp.93-98
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