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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
US |
2011-07-28 11:55 |
Kyoto |
Kyoto Electronics Manufacturing Co., Ltd. |
Brillouin scattering by induced phonon in the GHz range emitted from ZnO piezoelectric thin film Takeshi Sugimoto, Hiroyuki Sano (Doshisha Univ.), Takahiko Yanagitani (Nagoya Inst. Tech.), Shinji Takayanagi, Mami Matsukawa (Doshisha Univ.) US2011-25 |
Brillouin scattering is a nondestructive and noncontact technique to measure local longitudinal and shear acoustic veloc... [more] |
US2011-25 pp.15-19 |
AI |
2010-11-19 15:45 |
Fukuoka |
Kyushu Univ. |
Implementing a Web Page Segmentaion Method Based on a Role of a Content Hiroyuki Sano, Tatsuya Doi, Shun Shiramatsu, Tadachika Ozono, Toramatsu Shintani (NIT) AI2010-41 |
Our web page segmentation method divides a web page into Smallest-Blocks, and then assemble some Smallest-Blocks into Co... [more] |
AI2010-41 pp.61-66 |
US |
2010-09-30 13:25 |
Miyagi |
Tohoku Univ. |
Brillouin scattering from phonons induced by coaxial microwave resonator and ZnO transducer Hiroyuki Sano (Doshisha Univ.), Takahiko Yanagitani (Nagoya Inst. Tech.), Shinji Takayanagi, Mami Matsukawa (Doshisha Univ.) US2010-66 |
Brillouin scattering is a nondestructive technique to measure sound velocity propagated in transparent material, using a... [more] |
US2010-66 pp.99-103 |
US |
2009-09-30 09:25 |
Hokkaido |
Noboribetsu Grand Hotel |
Measurement of in-plane electric properties in a piezoelectric semiconductor by Brillouin scattering method Takahiko Yanagitani (Nagoya Inst. of Tech.), Hiroyuki Sano, Mami Matsukawa (Doshisha Univ.) US2009-48 |
Non-contact electric property measurements are required in semiconductor samples to avoid mechanical and chemical damage... [more] |
US2009-48 pp.59-64 |
CPM, ICD |
2008-01-18 14:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
Assessment Test for Solder Joint Reliability in Mobile Products Masazumi Amagai, Hiroyuki Sano (TI Japan) CPM2007-144 ICD2007-155 |
When a mobile phone is dropped, the frequency of occurrence of cracks in solder joints is high. Voids in intermetallic ... [more] |
CPM2007-144 ICD2007-155 pp.93-98 |
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