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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
EMD, LQE, OPE, CPM, R |
2014-08-21 11:35 |
Hokkaido |
Otaru Economy Center |
Integrated waveguide type membrane DFB lasers by BCB bonding on Si substrate Daisuke Inoue, Jieun Lee, Takuo Hiratani, Yuki Atsuji, Tomohiro Amemiya, Nobuhiko Nishiyama, Shigehisa Arai (Tokyo Inst. of Tech.) R2014-26 EMD2014-31 CPM2014-46 OPE2014-56 LQE2014-30 |
On-chip optical interconnection technology which can replace copper electrical global wiring to optical wiring is expect... [more] |
R2014-26 EMD2014-31 CPM2014-46 OPE2014-56 LQE2014-30 pp.17-22 |
OPE |
2012-12-21 16:45 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Characteristics of InP-based passive devices of Si substrate with BCB adhesive wafer bonding for on-chip interconnects Jieun Lee, Yoshiaki Yamahara, Yuki Atsumi, Nobuhiko Nishiyama (TiTech), Shigehisa Arai (TiTech/QNERC) OPE2012-141 |
For InP-based membrane photonic circuits on Si-LSI, a GaInAsP wire waveguide and basic functional passive devices based ... [more] |
OPE2012-141 pp.39-44 |
OPE |
2010-12-17 17:30 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
The characteristics of GaInAsP wired waveguide on Si substrate with BCB bonding Yasuna Maeda, Jieun Lee, Yuki Atsumi, Nobuhiko Nishiyama, Shigehisa Arai (Tokyo Tech) OPE2010-141 |
To overcome LSI performance limitation due to the global electrical wiring of LSIs, the realization of the ultra-low-po... [more] |
OPE2010-141 pp.55-60 |
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