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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 5 of 5  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
NS, IN
(Joint)
2018-03-01
09:20
Miyazaki Phoenix Seagaia Resort VM Migration Management for QoS Optimization in Mobile Edge Computing
Jun Kikuchi (Nagoya Univ.), Celimuge Wu (The Univ. of Electro-Communications), Yusheng Ji (NII), Murase Tutomu (Nagoya Univ.) IN2017-98
For mobile edge computing (MEC), congestion avoidance can be achieved by distributing the workloads across multiple base... [more] IN2017-98
pp.51-56
NS, IN
(Joint)
2017-03-03
13:20
Okinawa OKINAWA ZANPAMISAKI ROYAL HOTEL Performance Evaluation on Wireless Multi-hop Networks connected to Mobile Edge Computing
Jun Kikuchi (Nagoya Univ.), Celimuge Wu (UEC), JI Yusheng (NII), Tutomu Murase (Nagoya Univ.) IN2016-156
For mobile edge computing, congestion avoidance can be achieved by distributing the workloads across multiple base stati... [more] IN2016-156
pp.353-358
IN, MoNA, CNR
(Joint)
2016-11-17
10:55
Kagoshima Kirishima-kanko Hotel Improvement by Sever Migration to Less Congested Node on Mobile Edge Computing
Jun Kikuchi, Tutomu Murase (Nagoya Univ.) IN2016-60
In this paper we investigate improvement of throughput by server migration to less congested node on mobile edge computi... [more] IN2016-60
pp.1-6
ED, MW 2008-01-17
09:45
Tokyo Kikai-Shinko-Kaikan Bldg. Examination of dual band CMOS RF power amplifier circuit
Jun Kikuchi (Gunma Univ.), Hisayasu Sato (Renesas Technology Corporation), Noboru Ishihara (Gunma Univ.) ED2007-214 MW2007-145
Dual-band CMOS RF power amplifier circuit design techniques have been studied. In CMOS power amplifier design with low p... [more] ED2007-214 MW2007-145
pp.45-50
ED, MW 2008-01-17
10:10
Tokyo Kikai-Shinko-Kaikan Bldg. Wide-Band BPSK CMOS Demodulator Circuit
Yasuyuki Arai, Jun Kikuchi, Ryuichi Ujiie, Kenichi Shibata (Gunma Univ.), Tetuya Hirama, Hisayasu Sato (Renesas Technology), Noboru Ishihara (Gunma Univ.) ED2007-215 MW2007-146
In recent LSI systems, the wiring connections between the LSI and the LSI or the board and the board have become high de... [more] ED2007-215 MW2007-146
pp.51-56
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