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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
EMT, EST, LQE, MWP, OPE, PEM, PN, IEE-EMT [detail] |
2018-01-26 10:20 |
Hyogo |
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Design of wavefront control type WSS and fold-back type WSS using silicon waveguides Fumi Nakamura, Hideaki Asakura, Kyosuke Muramatsu (Keio Univ.), Keijiro Suzuki, Ken Tanizawa, Minoru Ohtsuka, Nobuyuki Yokoyama, Kazuyuki Matsumaro, Miyoshi Seki, Keiji Koshino, Kazuhiro Ikeda, Shu Namiki, Hitoshi Kawashima (AIST), Hiroyuki Tsuda (Keio Univ.) PN2017-85 EMT2017-122 OPE2017-163 LQE2017-145 EST2017-121 MWP2017-98 |
A wavelength selective switch (WSS) is an optical device for routing the wavelength division multiplexed (WDM) signal to... [more] |
PN2017-85 EMT2017-122 OPE2017-163 LQE2017-145 EST2017-121 MWP2017-98 pp.275-280 |
OCS, OPE |
2015-05-15 16:20 |
Tokyo |
Kikai-Shinko-Kaikan Bldg(Tokyo) |
32x32 Strictly Non-Blocking Si-Wire Optical Path Switch Ken Tanizawa, Keijiro Suzuki, Munehiro Toyama, Minoru Ohtsuka, Nobuyuki Yokoyama, Kazuyuki Matsumaro, Miyoshi Seki, Keiji Koshino (AIST), Toshio Sugaya (Furukawa Electric), Satoshi Suda, Guangwei Cong (AIST), Toshio Kimura (Furukawa Electric), Kazuhiro Ikeda, Shu Namiki, Hitoshi Kawashima (AIST) OCS2015-8 OPE2015-8 |
In order to realize dynamic optical path networks that transmit coarse-granular video traffics with ultra-low energy con... [more] |
OCS2015-8 OPE2015-8 pp.33-38 |
LQE, OPE |
2013-06-21 10:35 |
Tokyo |
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Silicon photonics devices on 300 mm wafer fabricated by using ArF immersion lithography Tomohiro Kita, Yuichiro Tanushi, Masaki Nara, Syu Hirano (Tohoku Univ.), Munehiro Toyama, Miyoshi Seki, Keiji Koshino, Nobuyuki Yokoyama, Minoru Ohtsuka, Akinobu Sugiyama, Eiichi Ishitsuka, Tsukuru Sano, Tsuyoshi Horikawa (AIST), Hirohito Yamada (Tohoku Univ.) OPE2013-7 LQE2013-17 |
We have investigated optical characteristics of Si photonics devices formed on 300 mm SOI wafers by using ArF immersion ... [more] |
OPE2013-7 LQE2013-17 pp.1-5 |
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