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Committee Date Time Place Paper Title / Authors Abstract Paper #
ICD, MW 2016-03-02
Hiroshima Hiroshima University A Study of Multilayer Printed Wiring Boards Using the Anisotropic Conductive Paste
Hidenori Ishibashi (MELCO), Kenji Nagase (MEE), Tetsu Owada, Yoichi Kitamura, Naofumi Yoneda, Hiroaki Miyashita (MELCO) MW2015-173 ICD2015-96
In recent years, the resin multilayer wiring boards are used in the radio frequency circuits. They use through hole via ... [more] MW2015-173 ICD2015-96
MW 2008-12-12
Toyama Toyama-Univ. Gofuku-camp. A Millimeter-wave Reduced-sized Power Divider with Shunt Capacitors Embedded in Multilayered Substrates
Yukihiro Tahara, Takeshi Yuasa (Mitsubishi Electric.Co.), Kenji Nagase (Mitsubishi Electric Engineering. Co Ltd.), Naofumi Yoneda (Mitsubishi Electric.Co.) MW2008-161
Various reduced-sized Wilkinson power dividers loaded with capacitors or stubs have been reported. In this report, a com... [more] MW2008-161
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