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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2016-01-22
13:55
Tokyo Sanjo Conference Hall, The University of Tokyo Fabrication of highly reliable Co(W) thin film by physical vapor deposition for next generation ULSI Cu interconnects
Taewoong Kim, Kouta Tomita, Takeshi Momose (Univ. of Tokyo), Takaaki Tsunoda, Takayuki Moriwaki (CANON ANELVA), Yukihiro Shimogaki (Univ. of Tokyo) SDM2015-114
 [more] SDM2015-114
pp.25-28
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