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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2020-02-07
13:30		 Tokyo Tokyo University-Hongo [Special Invited Talk] Possibility of intermetallic compounds for ultra-small scale interconnections
Junichi Koike, Linghan Chen (Tohoku Univ), Shinji Yokogawa (Univ. Elec-Comm) SDM2019-93		  [more] SDM2019-93
p.25
SDM 2019-10-24
09:30		 Miyagi Niche, Tohoku Univ. [Invited Talk] NiAl as Cu alternative for ultrasmall feature sizes
Linghan Chen, Junichi Koike, Daisuke Ando, Yuji Sutou (Tohoku Univ.) SDM2019-59		 Conventional Cu interconnect will suffer from a great line resistivity increase due to aggressive downscaling of the dim... [more] SDM2019-59
pp.29-33
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