IEICE Technical Committee Submission System
Conference Schedule
Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (Searched in: All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 10 of 10  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
HIP 2016-09-27
14:50
Nara   Gaze behavior toward sequentially presented face images in autism spectrum disorders II
Takao Fukui, Makoto Wada (Res Inst of NRCD) HIP2016-45
 [more] HIP2016-45
pp.15-18
HIP 2015-09-29
09:55
Kyoto Kyoto Terrsa Gaze behavior toward sequentially presented face images in autism spectrum disorders
Takao Fukui, Makoto Wada (NRCD) HIP2015-79
Autism spectrum disorders have deficits in social communication and previous studies demonstrated that their gaze behavi... [more] HIP2015-79
pp.35-38
CPM 2015-08-11
11:40
Aomori   Effect of surface adsorbate on chemical shifts of core-level spectra for silicon oxinitride film
Takahiro Takami, Makoto Wada, Yoshiharu Enta (Hirosaki Univ.) CPM2015-45
For silicon oxynitride (SiON) layers formed under specific conditions, unusual core-level spectra, which have large chem... [more] CPM2015-45
pp.71-74
SDM 2015-03-02
13:35
Tokyo Kikai-Shinko-Kaikan Bldg [Invited Talk] CNT Via Integration with Highly Dense and Selective CNT Growth
Atsunobu Isobayashi, Makoto Wada, Ban Ito, Tatsuro Saito, Daisuke Nishide, T. Ishikura, Masayuki Katagiri, Yuichi Yamazaki, Takashi Matsumoto, Masayuki Kitamura, Masahito Watanabe, Naoshi Sakuma, Akihiro Kajita, Tadashi Sakai (LEAP) SDM2014-167
In this study, a highly selective carbon nanotube (CNT) via process was developed using a sacrificial spin-on carbon (SO... [more] SDM2014-167
pp.29-32
SDM 2013-02-04
11:25
Tokyo Kikai-Shinko-Kaikan Bldg. *
Takashi Kurusu, Hiroyoshi Tanimoto, Makoto Wada, Atsunobu Isobayashi, Akihiro Kajita, Nobutoshi Aoki, Yoshiaki Toyoshima (Toshiba)
 [more]
ICD 2012-12-17
15:55
Tokyo Tokyo Tech Front [Poster Presentation] A Hardware-Friendly Object Recognition Algorithm Using Log Polar Coordinate Transformation
Makoto Wada, Tadashi Shibata (UT) ICD2012-96
SIFT and SIFT-based algorithms are widely used in a variety of image recognition problems. However
they present the fol... [more]
ICD2012-96
p.35
ICD, SDM 2012-08-03
09:25
Hokkaido Sapporo Center for Gender Equality, Sapporo, Hokkaido [Invited Talk] Nanocarbon Interconnects -- Aiming to replace ultra-fine metal interconnects --
Akihiro Kajita, Makoto Wada, Tatsuro Saito, Masayuki Kitamura, Yuichi Yamazaki, Masayuki Katagiri, Ban Ito, Daisuke Nishide, Takashi Matsumoto, Atsunobu Isobayashi, Mariko Suzuki, Atsuko Sakata, Masahito Watanabe, Naoshi Sakuma, Tadashi Sakai (LEAP) SDM2012-78 ICD2012-46
The width of interconnects has been shrinking toward 10nm in accordance with LSI devices shrinkage. The resistivity of s... [more] SDM2012-78 ICD2012-46
pp.83-87
SDM 2011-02-07
12:40
Tokyo Kikai-Shinko-Kaikan Bldg. A highly reliable Cu interconnect with CuSiN and Ti-based barrier metal: Impact of oxgen surface treatment
Yumi Hayashi, Noriaki Matsunaga, Makoto Wada, Shinichi Nakao, Kei Watanabe, Satoshi Kato, Atsuko Sakata, Akihiro Kajita, Hideki Shibata (Toshiba Corp.) SDM2010-219
A trade-off property of CuSiN between EM improvement and line resistance increase was resolved by a breakthrough that le... [more] SDM2010-219
pp.19-23
SDM 2010-02-05
14:00
Tokyo Kikai-Shinko-Kaikan Bldg. Low resistive and highly reliable copper interconnects in combination of silicide-cap with Ti-barrier for 32 nm-node and beyond
Yumi Hayashi, Noriaki Matsunaga, Makoto Wada, Shinichi Nakao, Atsuko Sakata, Kei Watanabe, Hideki Shibata (Toshiba) SDM2009-187
Silicide-cap for Cu interconnects is promising for enhancing electromigration (EM) performance for 32 nm-node and beyond... [more] SDM2009-187
pp.31-36
SDM 2009-11-13
11:15
Tokyo Kikai-Shinko-Kaikan Bldg. A Novel Monte Carlo Simulation to Evaluate the Size Effect of Resistivity for Scaled Metallic Interconnects
Takashi Kurusu, Makoto Wada, Noriaki Matsunaga, Akihiro Kajita, Hiroyoshi Tanimoto, Nobutoshi Aoki, Yoshiaki Toyoshima, Hideki Shibata (Toshiba Corp.) SDM2009-145
Recently, the size effect on resistivity in very narrow and thin metallic wires is a crucial problem on development of s... [more] SDM2009-145
pp.55-60
 Results 1 - 10 of 10  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)


[Return to Top Page]

[Return to IEICE Web Page]


The Institute of Electronics, Information and Communication Engineers (IEICE), Japan