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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SDM |
2010-02-05 15:15 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. |
Chip-Level and Package-Level Seamless Interconnect Technologies for Advanced Packaging Shintaro Yamamichi, Kentaro Mori, Katsumi Kikuchi, Hideya Murai, D. Ohshima, Y. Nakashima (NEC), Kouji Soejima, Masaya Kawano (NEC Electronics), Tomoo Murakami (NEC) SDM2009-189 |
Interposer-process-oriented thick-Cu-wiring technologies have been developed. Cu wiring thickness is 5 to 10 um, and int... [more] |
SDM2009-189 pp.43-48 |
CPM, ICD |
2008-01-18 15:20 |
Tokyo |
Kikai-Shinko-Kaikan Bldg |
A multi-layer wafer-level 5-um-thick Cu wiring technology with photosensitive resin Katsumi Kikuchi (NEC), Kouji Soejima (NECEL), Yasuhiro Ishii (NEC), Masaya Kawano (NECEL), Masayuki Mizuno, Shintaro Yamamichi (NEC) CPM2007-146 ICD2007-157 |
We have successfully developed a multi-layer wafer-level 5-um-thick Cu wiring technology and an embedded on-chip capacit... [more] |
CPM2007-146 ICD2007-157 pp.105-110 |
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