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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2020-02-07
10:45		 Tokyo Tokyo University-Hongo [Invited Talk] Role of electroless-Ni plating in high-aspect-ratio TSV fabrication for 3D integration and packaging
Murugesan Mariappan, Takafumi Fukushima (Tohoku Univ.) SDM2019-91		  [more] SDM2019-91
pp.15-19
SDM 2019-02-07
11:25		 Tokyo   [Invited Talk] Ultrafine 3D Interconnect Technology Using Directed Self-Assembly
Takafumi Fukushima, Murugesan Mariappan, Mitsumasa Koyanagi (Tohoku Univ.) SDM2018-92		 A directed self-assembly (DSA) technology is applied to fabricate ultrafine pitch TSV (Through-Silicon Vias) for ultra-h... [more] SDM2018-92
pp.5-8
SDM 2011-02-07
14:55		 Tokyo Kikai-Shinko-Kaikan Bldg. Stress Mapping in Thinned Si Wafer with Cu-TSV and Cu-Sn Microbumps
Murugesan Mariappan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) SDM2010-223		  [more] SDM2010-223
pp.43-47
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