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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
R 2022-11-17
14:50
Online Online Dimensional Stabilization by High-Order Structure Control of Liquid Crystal Polymers for Electronic Components
Toyohiro Imaizumi, Osamu Otani (omron) R2022-42
In mechanical devices such as relays, switches, and connectors, molded liquid crystal polymers are used because of their... [more] R2022-42
pp.13-16
EMD, R 2012-02-17
10:35
Kyoto   The improvement of the sealing reliability of relays which use polycarbonate for the case
Yosuke Tatsuno, Osamu Otani, Tomohiro Fukuhara (OMRON) R2011-42 EMD2011-116
 [more] R2011-42 EMD2011-116
pp.1-6
R 2010-11-19
14:50
Osaka   The improvement of the sealing reliability of relays by the means of reducing permeability in sealing adhesives
Tomohiro Fukuhara, Mitsuo Ito, Osamu Otani (OMRON) R2010-34
Relays are used for various purposes, and are demanded for high operating reliability in a variety of environments. Seal... [more] R2010-34
pp.9-13
EMD, R 2010-02-19
13:00
Osaka   A Study on Improvement for Seal property of Electromechanical Devices -- The behavior of One-Part Epoxy Resin in a narrow gap --
Osamu Otani, Seiji Nakajima, Tomohiro Fukuhara (OMRON Corp.) R2009-51 EMD2009-118
Generally, one-part epoxy resin consists of liquid epoxy monomer, solid curing agent, and filler as a packing agent and ... [more] R2009-51 EMD2009-118
pp.7-11
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