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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
R |
2022-11-17 14:50 |
Online |
Online (Online) |
Dimensional Stabilization by High-Order Structure Control of Liquid Crystal Polymers for Electronic Components Toyohiro Imaizumi, Osamu Otani (omron) R2022-42 |
In mechanical devices such as relays, switches, and connectors, molded liquid crystal polymers are used because of their... [more] |
R2022-42 pp.13-16 |
EMD, R |
2012-02-17 10:35 |
Kyoto |
(Kyoto) |
The improvement of the sealing reliability of relays which use polycarbonate for the case Yosuke Tatsuno, Osamu Otani, Tomohiro Fukuhara (OMRON) R2011-42 EMD2011-116 |
[more] |
R2011-42 EMD2011-116 pp.1-6 |
R |
2010-11-19 14:50 |
Osaka |
(Osaka) |
The improvement of the sealing reliability of relays by the means of reducing permeability in sealing adhesives Tomohiro Fukuhara, Mitsuo Ito, Osamu Otani (OMRON) R2010-34 |
Relays are used for various purposes, and are demanded for high operating reliability in a variety of environments. Seal... [more] |
R2010-34 pp.9-13 |
EMD, R |
2010-02-19 13:00 |
Osaka |
(Osaka) |
A Study on Improvement for Seal property of Electromechanical Devices
-- The behavior of One-Part Epoxy Resin in a narrow gap -- Osamu Otani, Seiji Nakajima, Tomohiro Fukuhara (OMRON Corp.) R2009-51 EMD2009-118 |
Generally, one-part epoxy resin consists of liquid epoxy monomer, solid curing agent, and filler as a packing agent and ... [more] |
R2009-51 EMD2009-118 pp.7-11 |
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