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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2014-02-28
11:00
Tokyo Kikai-Shinko-Kaikan Bldg. [Invited Talk] Impact of Back Grind Damage on Si Wafer Thinning for 3D Integration
Yoriko Mizushima (Fujitsu Lab./Tokyo Inst. of Tech.), Youngsuk Kim (Tokyo Inst. of Tech./Disco), Tomoji Nakamura (Fujitsu Lab.), Ryuichi Sugie, Hideki Hashimoto (Toray Research Center), Akira Uedono (Univ. of Tsukuba), Takayuki Ohba (Tokyo Inst. of Tech.) SDM2013-167
Ultra-thin wafer is indispensable for bumpless 3D stacking. To know the thinning damage in detail, an atomic level defec... [more] SDM2013-167
pp.13-18
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