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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
QIT
(2nd)
2011-11-21
14:40
Osaka Osaka Univ. Engr. Sci. Sigma Hall (Toyonaka) [Poster Presentation] Theory of Josepshon pi-junction through a ferromagnetic-insulator
Shuhei Nakamura, Satofumi Souma, Matsuto Ogawa (Kobe Univ), Shiro Kawabata (AIST)
We predict an anomalous 0-π transition in Josephson junctions with a ferromagnetic insulator (FI).
Previously it was f... [more]

OME 2009-01-21
14:50
Aichi Nagoya Univ. Development of a novel silicone compound with high thermal endurance
Hiroaki Cho, Fumito Sano, Shuhei Nakamura (Mie Univ.), Kazuyo Miyata (Japan Scie and Tech Agence Plaza Tokai), Wataru Shimizu, Yasushi Murakami (Shinshu Univ.) OME2008-90
Poly(dimethylsiloxane) (PDMS) is a base polymer of silicone compound which used, for example, as sealants, adhesives or ... [more] OME2008-90
pp.43-48
OME 2009-01-21
15:15
Aichi Nagoya Univ. A new low temperature vulcanized silicone compound
Yasunori Ashida, Shinya Kitamura, Hiroaki Cho, Shuhei Nakamura (Mie Univ), Wataru Shimizu, Yasushi Murakami (Shinshu Univ) OME2008-91
Room temperature vulcanized silicone compounds are usually made by using metal additives such as tin compound and their ... [more] OME2008-91
pp.49-54
OME 2006-11-10
13:50
Nagano Shinshu Univ. Organic-inorganic hybrid materials and their application to thermostable adhesives
Shuhei Nakamura, Atsushi Ohno, Yusuke Aoki (Mie Univ.), Takuya Shindou, Tadashi Kawakita (sfx)
 [more] OME2006-93
pp.13-18
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