IEICE Technical Committee Submission System
Conference Schedule		 Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (Searched in: All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 2 of 2  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2014-02-28
15:50		 Tokyo Kikai-Shinko-Kaikan Bldg. [Invited Talk] 15μm-pitch Bump Interconnections Relied on Flip-chip Bonding Technique -- for Advanced Chip Stacking Applications --
Masahiro Aoyagi, Thanh-Tung Bui, Fumiki Kato, Naoya Watanabe, Shunsuke Nemoto, Katsuya Kikuchi (AIST) SDM2013-173		 This paper reports the development of reliable fine-pitch micro-bump Cu/Au interconnections relied on a high-precision r... [more] SDM2013-173
pp.43-46
ICD, SDM 2012-08-02
14:15		 Hokkaido Sapporo Center for Gender Equality, Sapporo, Hokkaido 3D Interconnect Technology by the Ultrawide-Interchip-Bus System for 3D Stacked LSI Systems
Fumito Imura, Shunsuke Nemoto, Naoya Watanabe, Fumiki Kato, Katsuya Kikuchi, Hiroshi Nakagawa (AIST), Michiya Hagimoto, Hiroyuki Uchida, Takashi Omori, Yasumori Hibi, Yukoh Matsumoto (TOPS Systems), Masahiro Aoyagi (AIST) SDM2012-71 ICD2012-39		 We have proposed the ultrawide-interchip-bus system for the interchip communication of the 3-dimentional stacked LSI sys... [more] SDM2012-71 ICD2012-39
pp.43-48
 Results 1 - 2 of 2  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan