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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2023-02-07
14:00		 Tokyo Tokyo Univ.
(Primary: On-site, Secondary: Online)		 [Invited Talk] Applications of the surface activated bonding on heterogeneous Integration at room temperature
Tadatomo Suga (Meisei Univ.) SDM2022-89		 The potential application of surface-activated junction (SAB) to semiconductor 3D hetero-integration is presented. In pa... [more] SDM2022-89
pp.17-22
SDM 2018-02-08
15:30		 Tokyo Tokyo Univ. [Invited Talk] Low temperature Cu-Cu bonding by transient liquid phase sintering of mixed Cu nanoparticles and Sn-Bi eutectic powders
Muhammad Khairi Faiz, Takehiro Yamamoto (Waseda Univ.), Tadatomo Suga (Tokyo Univ.), Tomoyuki Miyashita, Makoto Yoshida (Waseda Univ.) SDM2017-102		  [more] SDM2017-102
pp.25-30
PN, OPE, EMT, LQE 2009-01-29
09:45		 Kyoto Kyoto Institute Technology (Matsugasaki Campus) Characteristics of InGaAsP/InP semiconductor laser chips on Si substrates bonded at low temperature in ambient air
Ryo Takigawa, Eiji Higurashi, Tadatomo Suga (The Univ. of Tokyo), Renshi Sawada (Kyushu Univ.) 		 [more]
ICD, CPM 2007-01-19
09:25		 Tokyo Kika-Shinko-Kaikan Bldg. Ultra-Fine Pitch Cu Bumpless Interconnect for High Density System Integration
Aktisu Shigetou, Toshihiro Itoh, Tadatomo Suga (Univ. of Tokyo) 		We report the studies on the ultra-fine pitch Cu bumpless interconnect relating to the direct bonding of CMP-Cu done by ... [more] CPM2006-142 ICD2006-184
pp.77-81
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