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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2024-02-21
15:50
Tokyo Tokyo University-Hongo-Engineering Bldg.4 (Tokyo, Online)
(Primary: On-site, Secondary: Online)
[Invited Talk] Recent Studies of WoW and CoW Cu-Cu Hybrid Bonding
Yoshihisa Kagawa, Yukako Ikegami, Takahiro Kamei, Hayato Iwamoto (SSS) SDM2023-87
In recent years, a variety of 3D stacked devices have been proposed. The Cu-Cu hybrid bonding that can realize high dens... [more] SDM2023-87
pp.31-35
ITE-IDY, EID, SID-JC [detail] 2019-08-02
15:55
Tokyo Kikai-Shinko-Kaikan Bldg. (Tokyo) [Invited Lecture] High-resolution full-color rewritable sheets realizing photo-quality image
Yuriko Kaino, Kenichi Kurihara, Aya Shuto, Hiroshi Mizuno, Yuki Oishi, Takahiro Kamei, Kazumasa Nomoto (R&D Center, Sony corp.)
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