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All Technical Committee Conferences (Searched in: Recent 10 Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
SDM |
2024-02-21 15:50 |
Tokyo |
Tokyo University-Hongo-Engineering Bldg.4 (Tokyo, Online) (Primary: On-site, Secondary: Online) |
[Invited Talk]
Recent Studies of WoW and CoW Cu-Cu Hybrid Bonding Yoshihisa Kagawa, Yukako Ikegami, Takahiro Kamei, Hayato Iwamoto (SSS) SDM2023-87 |
In recent years, a variety of 3D stacked devices have been proposed. The Cu-Cu hybrid bonding that can realize high dens... [more] |
SDM2023-87 pp.31-35 |
ITE-IDY, EID, SID-JC [detail] |
2019-08-02 15:55 |
Tokyo |
Kikai-Shinko-Kaikan Bldg. (Tokyo) |
[Invited Lecture]
High-resolution full-color rewritable sheets realizing photo-quality image Yuriko Kaino, Kenichi Kurihara, Aya Shuto, Hiroshi Mizuno, Yuki Oishi, Takahiro Kamei, Kazumasa Nomoto (R&D Center, Sony corp.) |
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