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Committee Date Time Place Paper Title / Authors Abstract Paper #
ICD, SDM, ITE-IST [detail] 2022-08-08
15:20
Online   Evaluation of IC Chip Response by Backside Voltage Disturbance in Flip Chip Packaging
Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.) SDM2022-40 ICD2022-8
Flip chip packaging has become a general technique for mounting semiconductor ICs due to the need for smaller area. Howe... [more] SDM2022-40 ICD2022-8
pp.27-30
ITS 2005-09-06
16:10
Tokyo Kikai-Shinko-Kaikan Bldg. The VMC(Vehicle Mobile Convergence) Concept
Yasuhisa Nakamura, Takahito Fukushima, Katsuya Osaku, Naoki Matsumoto, Daisuke Demachi (NTT DoCoMo)
In this paper, VMC(Vehicle Mobile Convergence) Concept for Advanced ITSservice is explained.
VMC is a high-level concep... [more]
ITS2005-31
pp.53-58
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