IEICE Technical Committee Submission System
Conference Schedule		 Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
 
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (Searched in: All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 6 of 6  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
WPT 2024-12-12
10:30		 Ishikawa Ohgigaoka Campus, Kanazawa Institute of Technology
(Primary: On-site, Secondary: Online)		 Transferred Power and Topological Structure in Wireless Power Transfer
Lunde Ardhenta, Takuya Hirata, Ichijo Hodaka (Univ. Miyazaki) WPT2024-26		  [more] WPT2024-26
pp.12-16
R 2017-11-16
15:30		 Osaka   Effects on Stresses in HALT
Raphael Pihet, Takuya Hirata, Hideki Kawai, Aoki Yuichi (ESPEC) R2017-53		 HALT (Highly Accelerated Limit Test) is an accelerated test which, by applying severe stresses, can identify the relativ... [more] R2017-53
pp.13-16
ASN 2015-11-06
16:40		 Tokyo NICT Koganei HQ Measurement and Analysis Trial of Strawberry Cultivation data for Local Agricultures
Atsushi Daikoku, Toshikatsu Mori, Jeong Wookyeong, Eiji Miyagaki, Takuya Hiratani (KOZO KEIKAKU), Satoshi Yamazaki (Numazu NIT), Takeshi Sasaki (Strawberry full-time farmer), Shinichiro1 Maejima, Hidenori Izusawa (Shizuoka Prefecture) ASN2015-76		  [more] ASN2015-76
pp.157-160
RECONF 2015-06-20
14:25		 Kyoto Kyoto University Tile-base PLA Cell with Uni-Switch Structure
Atsushi Nanri, Kosuke Murakami, Daijiro Murooka, Takuya Hirata, Qing Dong, Shigetoshi Nakatake (Univ. of Kitakyushu) RECONF2015-23		  [more] RECONF2015-23
pp.125-130
CAS, SIP, MSS, VLD, SIS [detail] 2014-07-11
13:20		 Hokkaido Hokkaido University Block-merge layout of an op-amp pair and its variability evaluation
Masashi Miyagawa, Masaya Shimoyama, Koichi Tanno (Miyazaki Univ.), Takuya Hirata, Ryuta Nishino, Shigetoshi Nakatake (Univ. of Kitakyushu), Akihiro Yamada (A.LSI Design Co.,LTD) CAS2014-39 VLD2014-48 SIP2014-60 MSS2014-39 SIS2014-39		  [more] CAS2014-39 VLD2014-48 SIP2014-60 MSS2014-39 SIS2014-39
pp.207-212
R 2011-11-18
14:10		 Osaka   Temperature Humidity Test of Silver-Epoxy Isotropic Conductive Adhesive
Takuya Hirata, Yuichi Aoki (ESPEC CORP.) R2011-35		 To evaluate the reliability test condition for Isotropic Conductive Adhesive (ICA), we curried out various temperature h... [more] R2011-35
pp.13-17
 Results 1 - 6 of 6  /   
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)

[Return to Top Page]

[Return to IEICE Web Page]
The Institute of Electronics, Information and Communication Engineers (IEICE), Japan