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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| EE | 2017-01-26 14:45 |
Nagasaki | Nagasaki University | [Poster Presentation]
Design of Regulator Circuit with Over-temperature Protection for Silicon Intelligent Neural Probes Satoru Nishino (Nagasaki Institute of Applied Science Univ), Keita Ito, Yoshiki Takezawa, Kenji Shimokawa, Tatsuya Goto, Shoma Uno, Hisashi Kino, Tetsu Tanaka (TOHOKU Univ), Koji Kiyoyama (Nagasaki Institute of Applied Science Univ)  EE2016-62 |
In recent years, there has been rapid development and increasing use of semiconductor technologies for recording from la... [more] | EE2016-62 pp.75-79 |
| SDM | 2016-01-22 15:25 |
Tokyo | Sanjo Conference Hall, The University of Tokyo | [Invited Talk]
Novel reconfigured wafer-to-wafer(W2W) hybrid bonding technology using ultra-high density nano-Cu filaments for exascale 2.5D/3D integration Kangwook Lee, Taksfumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) SDM2015-117 |
[more] | SDM2015-117 pp.39-43 |
| MBE, NC (Joint) |
2014-11-22 09:25 |
Miyagi | Tohoku University | Development of Adjustable Gain-Bandwidth Bio-signal Recording LSI and Si Neural Probe Module Takaharu Tani, Takuya Harashima, Hideki Naganuma, Misaki Kawahara, Takuma Iwagami, Keita Ito, Yusaku Suzuki, Taiki Goto, Hisashi Kino (Tohoku Univ.), Koji Kiyoyama (NiAS), Tetsu Tanaka (Tohoku Univ.) MBE2014-68 |
In this paper, we have designed and evaluated an adjustable gain-bandwidth LNA and ADC circuit chip, and successfully fa... [more] | MBE2014-68 pp.51-54 |
| NC, MBE (Joint) |
2013-11-22 10:50 |
Miyagi | Tohoku University | Visualization of spatial distribution of cerebral local field potential measured by a linear multi-electrode array Shumpei Watanabe, Norihiro Katayama, Akihiro Karashima, Tetsu Tanaka, Hajime Mushiake, Mitsuyuki Nakao (Tohoku Univ.) MBE2013-68 |
We propose a visualization method (LFP brain mapping) to capture the spatial organization and the state-transition of th... [more] | MBE2013-68 pp.13-18 |
| VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM (Joint) [detail] |
2012-11-27 10:45 |
Fukuoka | Centennial Hall Kyushu University School of Medicine | [Invited Talk]
Overview of 3D Integration Technology and Challenges for Volume Production Kangwook Lee, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) CPM2012-115 ICD2012-79 |
[more] | CPM2012-115 ICD2012-79 pp.15-22 |
| MBE, NC (Joint) |
2012-11-16 14:50 |
Miyagi | Tohoku University | [Invited Talk]
Development of intelligent Si neural probe for smart neuron-machine interface Tetsu Tanaka (Tohoku Univ.) MBE2012-53 NC2012-61 |
[more] | MBE2012-53 NC2012-61 pp.43-46(MBE), pp.1-4(NC) |
| SDM | 2011-02-07 14:55 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | Stress Mapping in Thinned Si Wafer with Cu-TSV and Cu-Sn Microbumps Murugesan Mariappan, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) SDM2010-223 |
[more] | SDM2010-223 pp.43-47 |
| SDM | 2010-02-05 10:05 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | [Keynote Address]
Key Issues and Future Prospects for 3-D Integration Technology Mitsumasa Koyanagi, Takafumi Fukushima, Kangwook Lee, Tetsu Tanaka (Tohoku Univ.) SDM2009-182 |
[more] | SDM2009-182 pp.1-6 |
| ICD, SDM | 2008-07-17 13:10 |
Tokyo | Kikai-Shinko-Kaikan Bldg. | [Invited Talk]
Super Chip Technology to Achieve Ultimate Integration Mitsumasa Koyanagi, Tetsu Tanaka (Tohoku Univ.) SDM2008-134 ICD2008-44 |
[more] | SDM2008-134 ICD2008-44 pp.35-40 |
| SDM | 2008-06-10 14:10 |
Tokyo | An401・402, Inst. Indus. Sci., The Univ. of Tokyo | Characterization of Metal Nanodots Nonvolatile Memory Yanli Pei, Masahiko Nishijima, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) SDM2008-56 |
[more] | SDM2008-56 pp.83-88 |
| NC | 2007-10-19 10:50 |
Miyagi | Tohoku University | Development of Si Double-sided Microelectrodes with Vertical Interconnction Risato Kobayashi, Takafumi Fukushima, Kazuhiro Sakamoto, Tetsu Tanaka, Norihiro Katayama, Hajime Mushiake, Mitsumasa Koyanagi (Tohoku Univ.) |
[more] | |
| ICD, CPM | 2007-01-18 15:20 |
Tokyo | Kika-Shinko-Kaikan Bldg. | [Special Invited Talk]
3-Dimensional Packaging Technology and Super-Chip Integration Tetsu Tanaka, Takafumi Fukushima, Mitsumasa Koyanagi (Tohoku Univ.) |
[more] | CPM2006-139 ICD2006-181 pp.61-65 |
| ICD, SIP, IE, IPSJ-SLDM | 2006-10-27 11:30 |
Miyagi | Reconfigurable Stacked Memory System for Parallel Image Processing Using Three-Dimensional LSI Technology Daijiro Amano, Takeaki Sugimura, Yuta Konishi, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) |
The real-time image processing system with a frame rate beyond video rate is required for the high-speed visual informat... [more] | SIP2006-108 ICD2006-134 IE2006-86 pp.43-48 |
|
| ICD, SIP, IE, IPSJ-SLDM | 2006-10-27 11:50 |
Miyagi | Design of parallel A/D Converter with Variation Correction for Parallel Image Processing system using Three-Dimensional Integration Technology Yuta Konishi, Takeaki Sugimura, Daijirou Amano, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi (Tohoku Univ.) |
[more] | SIP2006-109 ICD2006-135 IE2006-87 pp.49-54 |
|
| RECONF | 2006-05-18 13:00 |
Miyagi | TOHOKU UNIVERSITY | [Special Invited Talk]
Three-Dimensional Integration Technology and Reconfigurable 3D-SoC Mitsumasa Koyanagi, Takeaki Sugimura, Takafumi Fukushima, Tetsu Tanaka (Tohoku Univ.) |
[more] | RECONF2006-3 pp.13-18 |
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