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Committee Date Time Place Paper Title / Authors Abstract Paper #
ED, MW 2010-01-15
11:45		 Tokyo Kikai-Shinko-Kaikan Bldg Cost Effective Wafer-Level Chip Size Package Technology and Application for High Speed Wireless Communications.
Seiji Fujita, Masaki Imagawa, Tomio Satoh (SEDI), Tsuneo Tokumitsu (SEI), Yuichi Hasegawa (SEDI) ED2009-195 MW2009-178		 Cost effective Ku-band up-mixer and down-mixer MMIC’s, that use a three-dimensional MMIC technology optimized for flip-c... [more] ED2009-195 MW2009-178
pp.117-121
MW, EMCJ 2008-10-24
11:50		 Yamagata Yamagata Univ. Development of a Low-cost Up-converter MMIC for Ku-band VSAT Transmitter
Shinya Mizuno, Miki Kubota, Tomio Satoh, Yuichi Hasegawa (Eudyna) EMCJ2008-73 MW2008-117		 We developed an Up-converter MMIC in Plastic-Molded QFN Package for Ku-band VSAT transmitter. Using a general QFN Packag... [more] EMCJ2008-73 MW2008-117
pp.81-85
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