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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2020-02-07
10:10		 Tokyo Tokyo University-Hongo [Invited Talk] Stability of Cu Interconnect Surface after post CMP Cleaning
Yasuhiro Kawase, Toshiaki Shibata, Tomohiro Kusano (MCC), Ken Harada (imec), Kan Takeshita (MCC) SDM2019-90		 At present, more than 12 Cu interconnect layers have been formed in advanced semiconductor devices and each layer is pla... [more] SDM2019-90
pp.9-14
SDM 2018-02-08
13:50		 Tokyo Tokyo Univ. [Invited Talk] In-situ Analysis of Corrosion inhibitor behavior of Co surface
Toshiaki Shibta, Tomohiro Kusano, Ken Harada, Kan Takeshita, Yasuhiro Kawase (Mitsubishi Chemical Corp.) SDM2017-100		  [more] SDM2017-100
pp.15-18
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