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Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2010-02-05
15:15
Tokyo Kikai-Shinko-Kaikan Bldg. Chip-Level and Package-Level Seamless Interconnect Technologies for Advanced Packaging
Shintaro Yamamichi, Kentaro Mori, Katsumi Kikuchi, Hideya Murai, D. Ohshima, Y. Nakashima (NEC), Kouji Soejima, Masaya Kawano (NEC Electronics), Tomoo Murakami (NEC) SDM2009-189
Interposer-process-oriented thick-Cu-wiring technologies have been developed. Cu wiring thickness is 5 to 10 um, and int... [more] SDM2009-189
pp.43-48
CPM, ICD 2008-01-18
13:50
Tokyo Kikai-Shinko-Kaikan Bldg A Package-on-Package using Coreless Substrate with Excellent Power Integrity
Kentaro Mori, Jun Sakai, Katsumi Kikuchi, Shinji Watanabe, Tomoo Murakami, Shintaro Yamamichi (NEC) CPM2007-143 ICD2007-154
(To be available after the conference date) [more] CPM2007-143 ICD2007-154
pp.87-92
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