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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
VLD, DC, RECONF, ICD, IPSJ-SLDM
(Joint) [detail]
2020-11-17
09:30
Online Online Analysis of Resistance Distribution in Chips with Inductive Coupling Wireless Communication Interface
Hideto Kayashima, Hideharu Amano, Tsunaaki Shidei (Keio Univ.) VLD2020-19 ICD2020-39 DC2020-39 RECONF2020-38
Building Block Computing Systems, one of the 3D stacked LSI systems, use a wireless communication interface TCI (Through... [more] VLD2020-19 ICD2020-39 DC2020-39 RECONF2020-38
pp.48-53
VLD, DC, CPSY, RECONF, ICD, IE, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC
(Joint) [detail]
2019-11-15
15:20
Ehime Ehime Prefecture Gender Equality Center Evaluation of Inter-chip Inductive Coupling Wireless Communication Technology
Hideto Kayashima, Takuya Kojima, Hayate Okuhara, Tsunaaki Shidei, Hideharu Amano (Keio Univ.) CPSY2019-48
Building block computing systems, which is one of the three-dimensional stacked LSI systems, use a wireless communicatio... [more] CPSY2019-48
pp.59-64
VLD, IPSJ-SLDM 2019-05-15
15:50
Tokyo Ookayama Campus, Tokyo Institute of Technology The real chip evaluation of Through Chip Interface IP for Renesas 65nm SOTB process
Hideharu Amano, Hideto Kayashima, Tsunaaki Shidei, Takuya Kojima (Keio Univ.) VLD2019-5
(To be available after the conference date) [more] VLD2019-5
pp.31-36
ICD, CPSY 2016-12-15
10:30
Tokyo Tokyo Institute of Technology An Interectual Property for Wireless Inductive Coupling Through Chip Interface
Yusuke Matsushita, Koichiro Masuyama, Akio Nomura, Junichiro Kadomoto, Tsunaaki Shidei, Tadahiro Kuroda, Hideharu Amano (Keio Univ.) ICD2016-52 CPSY2016-58
 [more] ICD2016-52 CPSY2016-58
pp.7-12
SDM, ICD 2013-08-01
14:40
Ishikawa Kanazawa University [Invited Talk] A 0.15mm-Thick Non-Contact Connector for MIPI Using Vertical Directional Coupler
Atsutake Kosuge, Wataru Mizuhara, Tsunaaki Shidei, Tsutomu Takeya, Noriyuki Miura, Masao Taguchi, Hiroki Ishikuro, Tadahiro Kuroda (Keio Univ.) SDM2013-72 ICD2013-54
The world's first 0.15-mm-thick non-contact connector for Mobile Industry Processor Interface (MIPI) applications is pre... [more] SDM2013-72 ICD2013-54
pp.35-40
 Results 1 - 5 of 5  /   
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