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Committee Date Time Place Paper Title / Authors Abstract Paper #
VLD, DC, IPSJ-SLDM, CPSY, RECONF, ICD, CPM
(Joint) [detail]		 2013-11-27
15:30		 Kagoshima   [Invited Talk] Cu Wiring Technology for 3D/2.5D Packaging
Motoaki Tani, Yoshihiro Nakata, Tsuyoshi Kanki, Tomoji Nakamura (Fujitsu Lab.) VLD2013-75 CPM2013-119 ICD2013-96 CPSY2013-60 DC2013-41 RECONF2013-43		  [more] VLD2013-75 CPM2013-119 ICD2013-96 CPSY2013-60 DC2013-41 RECONF2013-43
pp.101-106(VLD), pp.63-68(CPM), pp.63-68(ICD), pp.9-14(CPSY), pp.101-106(DC), pp.21-26(RECONF)
SDM 2013-02-04
15:25		 Tokyo Kikai-Shinko-Kaikan Bldg. High Reliability Technology of Fine Pitch Re-wiring for High Density Chip Package -- Cu Re-wiring Covering with Metal-Cap Barrier Technology --
Tsuyoshi Kanki, Junya Ikeda, Shoichi Suda, Yasushi Kobayashi, Yoshihiro Nakata, Tomoji Nakamura (Fujitsu Labs) SDM2012-155		 In advancing minimization of Cu re-wiring for highly dense chip package at lower cost, the vital technology is to suppre... [more] SDM2012-155
pp.25-30
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