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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 9 of 9  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
HIP 2016-09-27
16:40
Nara   [Invited Talk] Reading brain-state by small fluctuation of eyes
Yasushi Kobayashi (Osaka Univ.) HIP2016-49
 [more] HIP2016-49
p.35
SDM 2016-01-22
13:00
Tokyo Sanjo Conference Hall, The University of Tokyo [Invited Talk] characterization of nitride thin film deposited at low temperatures
Mayumi B. Takeyama, Masaru Sato (Kitami inst.), Yasushi Kobayashi, Yoshihiro Nakata, Tomoji Nakamura (Fujitsu Lab.), Atsushi Noya (Kitami inst.) SDM2015-112
 [more] SDM2015-112
pp.17-20
CPM 2015-11-06
14:55
Niigata Machinaka Campus Nagaoka Characterization of SiNx films deposited at room temperature
Masaru Sato, Mayumi B. Takeyama (Kitami Inst. of Technol.), Yasushi Kobayashi, Yoshihiro Nakata, Tomoji Nakamura (Fujitsu Lab.), Atsushi Noya (Kitami Inst. of Technol.) CPM2015-88
 [more] CPM2015-88
pp.23-26
CPM 2015-08-10
14:40
Aomori   Low temperature deposition of SiNx films as an insulating barrier
Mayumi B. Takeyama, Masaru Sato (Kitami Inst. of Technol.), Yasushi Kobayashi, Yoshihiro Nakata, Tomoji Nakamura (Fujitsu Lab.), Atsushi Noya (Kitami Inst. of Technol.) CPM2015-34
 [more] CPM2015-34
pp.15-18
CPM 2014-10-25
09:40
Nagano   Characterization of low-temperature deposited SiNx films applicable to 3D/2.5D-IC
Mayumi B. Takeyama, Masaru Sato (Kitami Inst. of Tech.), Yasushi Kobayashi, Yoshihiro Nakata, Tomoji Nakamura (FUJITSU LAB.LTD.), Atsushi Noya (Kitami Inst. of Tech.) CPM2014-115
3-dimensional stacked LSI and/or 2.5-D IC is attracted much attention to solve the issues how to develop the integration... [more] CPM2014-115
pp.53-56
CPM 2013-10-24
16:55
Niigata Niigata Univ. Satellite Campus TOKIMEITO Properties of SiNx films prepared by low process temperature
Mayumi B. Takeyama, Masaru Sato (Kitami Inst. of Tech.), Yoshihiro Nakata, Yasushi Kobayashi, Tomoji Nakamura (FUJITSU LAB.), Atsushi Noya (Kitami Inst. of Tech.) CPM2013-100
3-dimensional stacked LSI is attracted much attention to solve the issues how to develop the integration density and/or ... [more] CPM2013-100
pp.35-39
SDM 2013-02-04
15:25
Tokyo Kikai-Shinko-Kaikan Bldg. High Reliability Technology of Fine Pitch Re-wiring for High Density Chip Package -- Cu Re-wiring Covering with Metal-Cap Barrier Technology --
Tsuyoshi Kanki, Junya Ikeda, Shoichi Suda, Yasushi Kobayashi, Yoshihiro Nakata, Tomoji Nakamura (Fujitsu Labs) SDM2012-155
In advancing minimization of Cu re-wiring for highly dense chip package at lower cost, the vital technology is to suppre... [more] SDM2012-155
pp.25-30
CPM 2012-08-09
09:50
Yamagata   Low temperature deposition of SiNx thin films by radical-assisted reaction
Mayumi B. Takeyama, Masaru Sato (Kitami Inst. Technol.), Yoshihiro Nakata, Yasushi Kobayashi, Tomoji Nakamura (Fujitsu Lab. Ltd.), Atsushi Noya (Kitami Inst. Technol.) CPM2012-45
3-dimensional stacked LSI is of high interest to overcome the issues how to develop the integration density and/or funct... [more] CPM2012-45
pp.51-54
NC 2005-10-17
- 2005-10-18
Kyoto   Effect of climbing fibre input on cerebellar purkinje cell activity
Yuichi Kobayashi (NAIST), Mitsuo Kawato (ATR-CNS), Kenji Kawano (Kyouto-U), Yasushi Kobayashi (Osaka-U)
 [more] NC2005-39
pp.13-17
 Results 1 - 9 of 9  /   
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