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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 7 of 7  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
HWS, VLD 2023-03-04
14:20
Okinawa
(Primary: On-site, Secondary: Online)
Side-channel Information Leakage Resistance Evaluation of Cryptographic Multi- chip Modules
Takumi Matsumaru, Kazuki Monta (Kobe Univ.), Takaaki Okidono (SCU), Takuzi Miki, Makoto Nagata (Kobe Univ.) VLD2022-122 HWS2022-93
Demand for multi-chip packaging technology is rising. This study focuses on two types of packaging technologies in parti... [more] VLD2022-122 HWS2022-93
pp.273-278
VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] 2022-11-29
14:40
Kumamoto  
(Primary: On-site, Secondary: Online)
Evaluating system level security of cryptography module
Takumi Matsumaru, Kazuki Monta (Kobe Univ.), Takaaki Okidono (SCU), Takuji Miki, Makoto Nagata (Kobe Univ.) VLD2022-32 ICD2022-49 DC2022-48 RECONF2022-55
Packaging technology is a technique used to encapsulate semiconductor chips in a frame, and has been attracting attentio... [more] VLD2022-32 ICD2022-49 DC2022-48 RECONF2022-55
pp.78-81
TL 2021-10-24
15:10
Online Online A latent semantic analysis of song lyrics in the 2.5D musical Touken Ranbu
Rieko Fujita, Akinori Takada (Ferris Univ.) TL2021-19
Although 2.5D musicals have grown in such popularity as to inspire their recognition as social phenomena, they are an al... [more] TL2021-19
pp.10-15
ICD, SDM, ITE-IST [detail] 2020-08-06
13:50
Online Online Over-the-top Si Interposer Embedding Backside Buried Metal to Reduce Power Supply Impedance
Takuji Miki, Makoto Nagata, Akihiro Tsukioka (Kobe Univ.), Noriyuki Miura (Osaka Univ.), Takaaki Okidono (ECSEC), Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi (AIST) SDM2020-5 ICD2020-5
A 2.5D structure with a Si interposer stacked on a CMOS chip is developed to reduce power supply impedance. A backside b... [more] SDM2020-5 ICD2020-5
pp.19-24
SDM 2020-02-07
14:55
Tokyo Tokyo University-Hongo [Invited Talk] A THIN BONDING MATERIAL FOR HIGH DENSITY HETEROGENEOUS INTEGRATION
Yasuhisa Kayaba, Yuzo Nakamura, Jun Kamada, Takashi Kozeki, Kazuo Kohmura (MCI) SDM2019-95
A new thin bonding material was developed for the heterogeneous device chip integration by Cu-Cu hybrid bonding. The bon... [more] SDM2019-95
pp.31-34
EMCJ, IEE-EMC, IEE-MAG 2017-05-19
13:20
Overseas Nanyang Technological University [Invited Talk] 2.5D Method of Modeling and Simulation for Signal/Power Integrity of High Speed Electronics
En-Xiao Liu, Siping Gao, Hui Min Lee (A*STAR IHPC) EMCJ2017-19
Electromagnetic characteristics related to signal integrity (SI), power integrity (PI) and EMC has become an essential d... [more] EMCJ2017-19
p.67
CPM 2016-11-19
10:00
Ishikawa   Cu(111) preferential orientation on TaWN ternary alloy barrier
Mayumi B. Takeyama, Masaru Sato (Kitami Inst. of Technol.) CPM2016-69
In this study, we examine that the Cu grain orientation control on the 5-nm-thick TaWN ternary alloy barrier. The strong... [more] CPM2016-69
pp.41-44
 Results 1 - 7 of 7  /   
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