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All Technical Committee Conferences (Searched in: All Years)
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Search Results: Conference Papers |
Conference Papers (Available on Advance Programs) (Sort by: Date Descending) |
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Committee |
Date Time |
Place |
Paper Title / Authors |
Abstract |
Paper # |
HWS, VLD |
2023-03-04 14:20 |
Okinawa |
(Primary: On-site, Secondary: Online) |
Side-channel Information Leakage Resistance Evaluation of Cryptographic Multi- chip Modules Takumi Matsumaru, Kazuki Monta (Kobe Univ.), Takaaki Okidono (SCU), Takuzi Miki, Makoto Nagata (Kobe Univ.) VLD2022-122 HWS2022-93 |
Demand for multi-chip packaging technology is rising. This study focuses on two types of packaging technologies in parti... [more] |
VLD2022-122 HWS2022-93 pp.273-278 |
VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] |
2022-11-29 14:40 |
Kumamoto |
(Primary: On-site, Secondary: Online) |
Evaluating system level security of cryptography module Takumi Matsumaru, Kazuki Monta (Kobe Univ.), Takaaki Okidono (SCU), Takuji Miki, Makoto Nagata (Kobe Univ.) VLD2022-32 ICD2022-49 DC2022-48 RECONF2022-55 |
Packaging technology is a technique used to encapsulate semiconductor chips in a frame, and has been attracting attentio... [more] |
VLD2022-32 ICD2022-49 DC2022-48 RECONF2022-55 pp.78-81 |
TL |
2021-10-24 15:10 |
Online |
Online |
A latent semantic analysis of song lyrics in the 2.5D musical Touken Ranbu Rieko Fujita, Akinori Takada (Ferris Univ.) TL2021-19 |
Although 2.5D musicals have grown in such popularity as to inspire their recognition as social phenomena, they are an al... [more] |
TL2021-19 pp.10-15 |
ICD, SDM, ITE-IST [detail] |
2020-08-06 13:50 |
Online |
Online |
Over-the-top Si Interposer Embedding Backside Buried Metal to Reduce Power Supply Impedance Takuji Miki, Makoto Nagata, Akihiro Tsukioka (Kobe Univ.), Noriyuki Miura (Osaka Univ.), Takaaki Okidono (ECSEC), Yuuki Araga, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi (AIST) SDM2020-5 ICD2020-5 |
A 2.5D structure with a Si interposer stacked on a CMOS chip is developed to reduce power supply impedance. A backside b... [more] |
SDM2020-5 ICD2020-5 pp.19-24 |
SDM |
2020-02-07 14:55 |
Tokyo |
Tokyo University-Hongo |
[Invited Talk]
A THIN BONDING MATERIAL FOR HIGH DENSITY HETEROGENEOUS INTEGRATION Yasuhisa Kayaba, Yuzo Nakamura, Jun Kamada, Takashi Kozeki, Kazuo Kohmura (MCI) SDM2019-95 |
A new thin bonding material was developed for the heterogeneous device chip integration by Cu-Cu hybrid bonding. The bon... [more] |
SDM2019-95 pp.31-34 |
EMCJ, IEE-EMC, IEE-MAG |
2017-05-19 13:20 |
Overseas |
Nanyang Technological University |
[Invited Talk]
2.5D Method of Modeling and Simulation for Signal/Power Integrity of High Speed Electronics En-Xiao Liu, Siping Gao, Hui Min Lee (A*STAR IHPC) EMCJ2017-19 |
Electromagnetic characteristics related to signal integrity (SI), power integrity (PI) and EMC has become an essential d... [more] |
EMCJ2017-19 p.67 |
CPM |
2016-11-19 10:00 |
Ishikawa |
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Cu(111) preferential orientation on TaWN ternary alloy barrier Mayumi B. Takeyama, Masaru Sato (Kitami Inst. of Technol.) CPM2016-69 |
In this study, we examine that the Cu grain orientation control on the 5-nm-thick TaWN ternary alloy barrier. The strong... [more] |
CPM2016-69 pp.41-44 |
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