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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 14 of 14  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
EMD, CPM, OME 2016-06-17
16:20
Tokyo Kikai-Shinko-Kaikan Bldg. Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards (2nd Report)
Tomokatsu Aizawa (Tokyo Metropolitan College), Yoshitaka Sugiyama (Yazaki) EMD2016-15 CPM2016-22 OME2016-25
This paper describes a novel welding technique for overlapped copper foils of rigid and flexible printed circuit boards.... [more] EMD2016-15 CPM2016-22 OME2016-25
pp.39-42
EMD 2015-11-06
11:25
Miyagi Tohoku University, School of engineering, Aoba memorial hall Magnetic Pulse Spot Welding of Flexible Printed Circuits
Tomokatsu Aizawa (Tokyo Metropolitan College), Yoshitaka Sugiyama (Yazaki Corporation), Mehrdad Kashani (Tokyo Metropolitan College), Kenichi Hanazaki (Yazaki Corporation) EMD2015-78
This paper describes a novel spot welding technique for overlapped copper foils of flexible printed circuits (FPC) and i... [more] EMD2015-78
pp.63-66
EMD 2013-05-17
13:35
Hokkaido Chitose Arcadia Plaza Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards
Tomokatsu Aizawa (Tokyo Metropolitan College) EMD2013-1
This paper describes a novel welding technique for copper foils on rigid and flexible printed circuit boards and its exp... [more] EMD2013-1
pp.1-4
EMD 2012-12-21
13:45
Tokyo Kikai-Shinko-Kaikan Bldg. [Special Talk] Fundamental Experiments for Magnetic Pulse Welding of Electric and Electronic Parts
Tomokatsu Aizawa (Tokyo Metropolitan College) EMD2012-92
Copper and aluminum materials such as a sheet, foil, a terminal board, a wire are connected by magnetic pulse welding (M... [more] EMD2012-92
pp.7-12
EMD 2012-01-20
14:50
Kanagawa   Non-Contact PIM Characteristic Evaluation of Printed Circuit Boards using the Standing Coaxial Tube Method
Keita Hoshino, Daijiro Ishibashi, Kensuke Saito, Nobuhiro Kuga (Yokohama Nat'l Univ.) EMD2011-115
Using printed circuit boards (PCBs), this report discusses the sample shape condition suitable for Standing-Wave Coaxial... [more] EMD2011-115
pp.19-24
EMD, CPM, OME 2011-06-30
10:00
Tokyo   Magnetic Pulse Welding of Copper Foils on Flexible Print Circuit without Using Driver
Tomokatsu Aizawa (Tokyo Metropolitan College) EMD2011-8 CPM2011-44 OME2011-22
This paper describes a new welding technique for copper foils on flexible printed circuit boards and its experimental re... [more] EMD2011-8 CPM2011-44 OME2011-22
pp.1-4
EMD 2010-12-17
13:25
Tokyo Tamagawa University Magnetic Pulse Welding of Copper Foils without Using Driver (2nd Report)
Tomokatsu Aizawa, Kazuo Matsuzawa, Keigo Okagawa (Tokyo Metropolitan College) EMD2010-130
This paper describes a copper foil welding technique by using magnetic pulse welding method without drivers and its expe... [more] EMD2010-130
pp.5-10
US 2010-12-16
15:45
Kanagawa Suzukakedai Campus, Tokyo Institute of Technology Welding of Braided Wire and Various Metal Specimens Using 20 kHz Ultrasonic Complex Vibration Welding Equipments -- Welding of Copper, Bimetal, Braided Wires, Aluminum and Copper Foils --
Jiromaru Tsujino (Kanagawa Univ.), Takashi Yokozuka, Shinichiro Suga (Apollo Engineering), Eiichi Sugimoto (Asahi EMS) US2010-89
Welding characteristics of copper, bimetal strip, flexible braided copper and tin coated copper wires consisted of thin ... [more] US2010-89
pp.23-28
EMD, CPM, OME 2010-06-25
17:10
Tokyo Kikai-Shinko-Kaikan Bldg. Magnetic Pulse Welding of Copper Foils without Using Driver
Tomokatsu Aizawa (Tokyo Metropolitan College), Yoshitaka Sugiyama (Yazaki Corp.), Keigo Okagawa (Tokyo Metropolitan College) EMD2010-16 CPM2010-30 OME2010-35
This paper describes a copper foil welding technique by using magnetic pulse welding method without drivers and its expe... [more] EMD2010-16 CPM2010-30 OME2010-35
pp.43-46
EMD 2008-12-19
13:55
Tokyo Tamagawa Univ. Magnetic Pulse Welding of Various Metal Foils such as Copper, Nickel, Stainless Steel
Tomokatsu Aizawa, Keigo Okagawa (Tokyo Metropolitan College. of Industrial Tech.) EMD2008-107
This paper describes a foil welding technique by applying pulsed magnetic pressure and its experimental results for vari... [more] EMD2008-107
pp.5-10
EMD 2008-01-25
14:25
Tokyo Kikai-Shinko-Kaikan Bldg. Joining Method through Holes between Insulated Conductors by Applying Magnetic Pressure
Tomokatsu Aizawa, Keigo Okagawa, Mehardad Kashani (Tokyo Metropolitan College) EMD2007-111
This paper describes a new joining method through holes between insulated conductors and its experimental results. When ... [more] EMD2007-111
pp.13-16
EMD 2007-12-21
15:55
Tokyo Japan Aviation Electronics Industry,Limited Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards (2nd Report)
Tomokatsu Aizawa (Tokyo Metropolitan College), Kenichi Hanazaki (Yazaki Corporation), Keigo Okagawa (Tokyo Metropolitan College) EMD2007-106
This paper describes a new welding technique for copper foils on
flexible printed circuit boards and its experimental r... [more]
EMD2007-106
pp.35-38
EMCJ, MW 2007-10-26
10:25
Miyagi Tohoku University Measurement of Millimeter-Wave Band Effective Conductivity of Sandwich-type Dielectric Substrates and Copper-clad Dielectric Substrates and Accuracy Enhancement by their comparison
Tran Thi Huong, Jiro Hirokawa (Tokyo Institute of Technology), Yoshinori Kogami (Utsunomiya Univ.), Makoto Ando (Tokyo Institute of Technology) EMCJ2007-69 MW2007-116
The measurement method of millimeter-wave band effective conductivity of copper-clad dielectric substrates has been prop... [more] EMCJ2007-69 MW2007-116
pp.89-94
EMD 2006-11-17
15:30
Kanagawa Fujitsu Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards
Tomokatsu Aizawa (College of Industrial Tech.), Kenichi Hanazaki (Yazaki Corporation), Keigo Okagawa (College of Industrial Tech.)
This paper describes a new welding technique for copper foils on flexible printed circuit boards and its experimental re... [more] EMD2006-57
pp.17-20
 Results 1 - 14 of 14  /   
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