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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 11 of 11  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
EMD, WPT, EMCJ, PEM
(Joint)
2022-07-15
14:25
Tokyo
(Primary: On-site, Secondary: Online)
A study on thin microstrip line with ground slit on flexible circuit for optical transceivers.
Yuya Yamaguchi (AGU), Akihisa Tsuchiya (KISTEC), Masahiro Takeda, Eiji Inami (Yamashita Materials), Hideaki Sugama (KISTEC), Osamu Hashimoto, Ryosuke Suga (AGU)
The high-speed optical communications and small devices were required for development of 5G and datacenter and low-loss ... [more]
MBE, MICT 2020-01-25
09:20
Kumamoto KKR Hotel Kumamoto Intraoperative Cerebral Measurements Using Implantable Cortical Multimodality Probe
Yuya Ishihara, Toshitaka Yamakawa (Kumamoto Univ.), Takao Inoue, Michiyasu Suzuki (Yamaguchi Univ.) MICT2019-39 MBE2019-68
In this study, a multimodality probe that simultaneously measures electroencephalograms, cerebral hemodynamics, and brai... [more] MICT2019-39 MBE2019-68
pp.3-5
EMCJ 2017-03-10
14:00
Tokyo Kikai-Shinko-Kaikan Bldg. Investigation on Characteristic Impedance of Differential Transmission Line in Meshed-ground Flexible Printed Circuit
Yantao Zhu, Fengchao Xiao (Univ. of Electro-Communications), Xiangyang Sun (Univ. of Electronic Science and Technology of China), Yoshiki Kayano, Yoshio Kami (Univ. of Electro-Communications) EMCJ2016-121
Meshed ground planes are extensively used in today’s flexible printed circuit (FPC) board because of its flexibility in ... [more] EMCJ2016-121
pp.5-10
EMD, CPM, OME 2016-06-17
16:20
Tokyo Kikai-Shinko-Kaikan Bldg. Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards (2nd Report)
Tomokatsu Aizawa (Tokyo Metropolitan College), Yoshitaka Sugiyama (Yazaki) EMD2016-15 CPM2016-22 OME2016-25
This paper describes a novel welding technique for overlapped copper foils of rigid and flexible printed circuit boards.... [more] EMD2016-15 CPM2016-22 OME2016-25
pp.39-42
EMD 2013-05-17
13:35
Hokkaido Chitose Arcadia Plaza Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards
Tomokatsu Aizawa (Tokyo Metropolitan College) EMD2013-1
This paper describes a novel welding technique for copper foils on rigid and flexible printed circuit boards and its exp... [more] EMD2013-1
pp.1-4
EMD 2012-12-21
13:45
Tokyo Kikai-Shinko-Kaikan Bldg. [Special Talk] Fundamental Experiments for Magnetic Pulse Welding of Electric and Electronic Parts
Tomokatsu Aizawa (Tokyo Metropolitan College) EMD2012-92
Copper and aluminum materials such as a sheet, foil, a terminal board, a wire are connected by magnetic pulse welding (M... [more] EMD2012-92
pp.7-12
EMD, CPM, OME 2011-06-30
10:00
Tokyo   Magnetic Pulse Welding of Copper Foils on Flexible Print Circuit without Using Driver
Tomokatsu Aizawa (Tokyo Metropolitan College) EMD2011-8 CPM2011-44 OME2011-22
This paper describes a new welding technique for copper foils on flexible printed circuit boards and its experimental re... [more] EMD2011-8 CPM2011-44 OME2011-22
pp.1-4
EMD, OPE, LQE, CPM 2010-08-27
12:05
Hokkaido Chitose Arcadia Plaza Compact 40-Gb/s Driver IC integrated EML Module Using Broadband FPC Connection Technique
Takatoshi Yagisawa, Tadashi Ikeuchi (FUJITSU/Optoelectronic Ind and Tech Development Association) EMD2010-50 CPM2010-66 OPE2010-75 LQE2010-48
The requirement for reducing the size and cost of 40-Gbit/s optical components has been strong. One of the most promisin... [more] EMD2010-50 CPM2010-66 OPE2010-75 LQE2010-48
pp.115-118
EMCJ 2009-06-05
09:40
Tokyo Tokyo Big Sight (Tokyo International Exihibition Center) Evaluation of transmission characteristic on relative humidity for flexible printed circuit board in microwave band
Akihisa Tsuchiya, Hideaki Sugama, Masami Sakurai, Naomi Hidaka (Kanagawa Ind. Tech Center), Osamu Hashimoto (Aoyama Gakuin Univ.) EMCJ2009-22
We evaluated transmission characteristics of microstrip line and coupled microstrip line fabricated with PI films in rel... [more] EMCJ2009-22
pp.1-5
EMD 2007-12-21
15:55
Tokyo Japan Aviation Electronics Industry,Limited Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards (2nd Report)
Tomokatsu Aizawa (Tokyo Metropolitan College), Kenichi Hanazaki (Yazaki Corporation), Keigo Okagawa (Tokyo Metropolitan College) EMD2007-106
This paper describes a new welding technique for copper foils on
flexible printed circuit boards and its experimental r... [more]
EMD2007-106
pp.35-38
EMD 2006-11-17
15:30
Kanagawa Fujitsu Magnetic Pressure Welding of Copper Foils on Flexible Printed Circuit Boards
Tomokatsu Aizawa (College of Industrial Tech.), Kenichi Hanazaki (Yazaki Corporation), Keigo Okagawa (College of Industrial Tech.)
This paper describes a new welding technique for copper foils on flexible printed circuit boards and its experimental re... [more] EMD2006-57
pp.17-20
 Results 1 - 11 of 11  /   
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