IEICE Technical Committee Submission System
Conference Schedule
Online Proceedings
[Sign in]
Tech. Rep. Archives
    [Japanese] / [English] 
( Committee/Place/Topics  ) --Press->
( Paper Keywords:  /  Column:Title Auth. Affi. Abst. Keyword ) --Press->

All Technical Committee Conferences  (Searched in: All Years)

Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 20 of 364  /  [Next]  
Committee Date Time Place Paper Title / Authors Abstract Paper #
CPSY, DC, IPSJ-ARC [detail] 2023-08-03
Hokkaido Hakodate Arena
(Primary: On-site, Secondary: Online)
Consideration of Bus Arbitration Method for Inductive Coupling Interface
Hideto Kayashima, Aika Kamei (Keio Univ.), Takuya Kojima (Tokyo Univ.), Hideharu Amano (Keio Univ.) CPSY2023-17 DC2023-17
(To be available after the conference date) [more] CPSY2023-17 DC2023-17
SDM, ICD, ITE-IST [detail] 2023-08-01
Hokkaido Hokkaido Univ. Multimedia Education Bldg. 3F
(Primary: On-site, Secondary: Online)
[Invited Talk] R and D of Low Power Semiconductor Technology and It's Application Expansions -- Review R and D of Semiconductor device and LSI for these 43 years --
Koichiro Ishibashi (UEC) SDM2023-38 ICD2023-17
LSI density has been doubling every two years for 64 years, since Moore’s law started in 1959. The presenter began resea... [more] SDM2023-38 ICD2023-17
EMD 2023-06-30
Hokkaido Chitose Arcadia Plaza Research on propulsion mechanism of amphibious robots
Shion Hayashibara, Ryo Nagase (CIT) EMD2023-4
Recently, unmanned delivery has been attracting attention, and inexpensive devices capable of propulsion in various envi... [more] EMD2023-4
IA, SITE, IPSJ-IOT [detail] 2023-03-15
Gunma Maebashi Institute of Technology
(Primary: On-site, Secondary: Online)
Approach to design ELSI handbook through the fusion of humanities and sciences
Hironori Furumiya, Kenichiro Yanagi, Reiko Takou, Masaru Miyazaki (NHK) SITE2022-57 IA2022-80
Ethical issues, legal issues, and social issues (ELSI) may arise when we attempt to implement new technologies in societ... [more] SITE2022-57 IA2022-80
HWS, VLD 2023-03-02
(Primary: On-site, Secondary: Online)
Implementation of power-outage tolerant VLSI system using asynchronous circuits
Masashi Imai (Hirosaki Univ.) VLD2022-86 HWS2022-57
Re-initialization free systems which contain nonvolatile memory have been proposed in order to cope with power-outage. H... [more] VLD2022-86 HWS2022-57
HWS, VLD 2023-03-03
(Primary: On-site, Secondary: Online)
Track Assignment considering Routing Crossing Relations to Improve Feasibility in Bottleneck Channel Routing
Kazuya Taniguchi, Satoshi Tayu, Atsushi Takahashi (Tokyo Tech), Molongo Mathieu, Makoto Minami, Katsuya Nishioka (Jedat) VLD2022-101 HWS2022-72
Design automation that realizes analog integrated circuits to meet performance specifications in a small area is desired... [more] VLD2022-101 HWS2022-72
ED 2022-12-08
Aichi 12/8 Nagoya University, 12/9 WINC AICHI Fabrication of a Double-Emitter Structure for Ultra-High Density Electrospray Ion Sources
Shujun Guo (YNU), Masayoshi Nagao, Katsuhisa Murakami, Hiromasa Murata (AIST), Yoshinori Takao (YNU) ED2022-49
We study electrospray thrusters that can be mounted on nano-satellites. The thrust density of these thrusters is lower t... [more] ED2022-49
ED 2022-12-08
Aichi 12/8 Nagoya University, 12/9 WINC AICHI Electrospray Ion Sources using SU-8 Thick-Film Photoresist for Microspacecraft
Takumi Shingu (YNU/AIST), Masayoshi Nagao, Katsuhisa Murakami, Hiromasa Murata (AIST), Yoshinori Takao (YNU) ED2022-50
We study electrospray ion sources as high-thrust propulsion for nanosatellites. Previously, we fabricated a high-density... [more] ED2022-50
SDM 2022-11-10
Online Online [Invited Talk] Progress in CMOS Device Technology and IRDS Roadmap
Hitoshi Wakabayashi (Tokyo Tech) SDM2022-64
CMOS Device Technology and International Roadmap for Devices and Systems (IRDS) are going to be discussed for logic LSIs... [more] SDM2022-64
CAS, SIP, VLD, MSS 2022-06-16
Aomori Hachinohe Institute of Technology
(Primary: On-site, Secondary: Online)
Dynamic Temperature Control Algorithm for 3-D Stacked Chips based on Thermal Analysis
Songxiang Wang, Kimiyoshi Usami (Shibaura IT) CAS2022-10 VLD2022-10 SIP2022-41 MSS2022-10
The problem of heat generation is more serious in 3D stacked chips than in non-stacked counterparts. In this study, we f... [more] CAS2022-10 VLD2022-10 SIP2022-41 MSS2022-10
CAS, SIP, VLD, MSS 2022-06-17
Aomori Hachinohe Institute of Technology
(Primary: On-site, Secondary: Online)
[Panel Discussion] Contributions of System and Signal Processing Subsociety to the SDGs
Shigemasa Takai (Osaka Univ.), Yoshinobu Maeda (Niigata Univ.), Namiko Ikeda (NTT), Toshihisa Tanaka (TUAT), Atsuo Ozaki (OIT) CAS2022-11 VLD2022-11 SIP2022-42 MSS2022-11
The four technical committees (TCs) on Systems and Signal Processing subsociety, i.e.,
TCs of Circuits and Systems (CA... [more]
CAS2022-11 VLD2022-11 SIP2022-42 MSS2022-11
EE, IEE-HCA 2022-05-27
Online Online [Special Talk] Research and development in power processing units for plasma propulsion
Yoshiki Matsunaga (JAXA), Toru Takahashi (TDS), Kazuhiro Kajiwara, Fujio Kurokawa (NiAS), Hiroaki Kusawake (JAXA) EE2022-3
The purpose of this paper is to describe power processing units (PPUs) for a space plasma propulsion called a Hall thrus... [more] EE2022-3
CPSY, DC, IPSJ-SLDM, IPSJ-EMB, IPSJ-ARC [detail] 2022-03-10
Online Online *
Hiroki Kawaguchi, Itsuki Fujita, Yoshikazu Nagamura (Tokyo Metropolitan Univ.), Masayuki Arai (Nihon Univ.), Satoshi Fukumoto (Tokyo Metropolitan Univ.) CPSY2021-55 DC2021-89
(To be available after the conference date) [more] CPSY2021-55 DC2021-89
VLD, HWS [detail] 2022-03-07
Online Online Bottleneck Channel Routing to Reduce the Area of Analog VLSI
Kazuya Taniguchi, Satoshi Tayu, Atsushi Takahashi (Tokyo Tech), Yukichi Todoroki, Makoto Minami (Jedat) VLD2021-77 HWS2021-54
Design automation that realizes analog integrated circuits to meet performance specifications in a small area is desired... [more] VLD2021-77 HWS2021-54
EE 2022-01-28
Online Online Basic Experiment of Anode Power Supply using LLC Resonant Converter for Hall Thruster Systems
Hiromasa Kondo, Shinatora Choh, Hiroki Watanabe, Hiroaki Kusawake (JAXA) EE2021-44
JAXA is studying an anode power supply for realizing lightweight Hall thruster systems. The anode power supply has criti... [more] EE2021-44
SITE, IPSJ-CE, IPSJ-CLE 2021-12-04
Online Online [Invited Talk] Artificial Intelligence, Data Science and ELSI Education in Primary and Secondary Education
Nagayoshi Nakazono (Reitaku Univ.) SITE2021-45
With the revision of the Courses of Study in 2017/18, there has been an increase of content related to artificial intell... [more] SITE2021-45
(Joint) [detail]
Online Online Diagnosis of Switching-Induced IR Drop by On-Chip Voltage Monitors
Kazuki (Kobe Univ.), Leonidas Kataselas (Aristotle Univ.), Ferenc Fodor (IMEC), Alkis Hatzopoulos (Aristotle Univ.), Makoto Nagata (Kobe Univ.), Erik Jan Marinissen (IMEC) VLD2021-31 ICD2021-41 DC2021-37 RECONF2021-39
On-chip monitor (OCM) circuits enable us to observe dynamic power-supply (PS) waveforms within power domains individuall... [more] VLD2021-31 ICD2021-41 DC2021-37 RECONF2021-39
SITE, ISEC, LOIS 2021-11-12
Online Online [Invited Talk] Integrating ELSI responses into business activities -- Practice of industry-academia collaboration in the humanities and social sciences --
Atsuo Kishimoto (Osaka Univ.) ISEC2021-46 SITE2021-40 LOIS2021-29
In April 2020, Osaka University established a university-wide organization called ELSI Center, which was established in ... [more] ISEC2021-46 SITE2021-40 LOIS2021-29
SITE, ISEC, LOIS 2021-11-12
Online Online [Invited Talk] ICT-ELSI in Graduate Level -- Case of "Ethics of Advanced Science and Technology" course --
Yuko Murakami (Rikkyo U) ISEC2021-47 SITE2021-41 LOIS2021-30
Considering artificial intelligence (AI) to be "advanced science and technology for information and knowledge," AI ethic... [more] ISEC2021-47 SITE2021-41 LOIS2021-30
CPM 2021-10-27
Online Online Study on the low-temperature deposition method of SiNx film for Cu-TSV
Masaru Sato, Mayumi B. Takeyama (Kitami Inst. of Tech.) CPM2021-21
For Cu through silicon via in the 3D-LSI, It is desired to realize a deposition method of an insulating film less than 2... [more] CPM2021-21
 Results 1 - 20 of 364  /  [Next]  
Choose a download format for default settings. [NEW !!]
Text format pLaTeX format CSV format BibTeX format
Copyright and reproduction : All rights are reserved and no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopy, recording, or any information storage and retrieval system, without permission in writing from the publisher. Notwithstanding, instructors are permitted to photocopy isolated articles for noncommercial classroom use without fee. (License No.: 10GA0019/12GB0052/13GB0056/17GB0034/18GB0034)

[Return to Top Page]

[Return to IEICE Web Page]

The Institute of Electronics, Information and Communication Engineers (IEICE), Japan