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Committee Date Time Place Paper Title / Authors Abstract Paper #
EMD 2013-01-25
15:50
Kanagawa Hitachi, Ltd., (Totsuka, Yokohama) An experimental study on a 3-D shape observation system of a sample by employing a laser displacement sensor
Makoto Hasegawa, Daichi Kawamura, Keisuke Takahashi (Chitose Inst. of Science and Tech.) EMD2012-100
For the purpose of observing and evaluating damaged shapes due to material transfer and erosion, caused by arc discharge... [more] EMD2012-100
pp.15-19
EMD, R 2009-02-20
13:45
Mie Sumitomo Wiring Systems LTD., Head Office Pull strength analysis of Pb free solder at a connected point
Taku Hashiguchi, Yuta Nasukawa, Kazunori Hiraoka (Salesian Polytecn.) R2008-51 EMD2008-127
Pull strength of Pb free solder at a connected point is tested and analyzed.
Experiments are performed with various p... [more]
R2008-51 EMD2008-127
pp.43-48
ICD, CPM 2005-09-09
11:20
Tokyo Kikai-Shinko-Kaikan Bldg. Development of New Surface Finish Technology for Package Substrates with Excellent Bondability
Kiyotaka Tsukada (IBIDEN)
This Paper describes the characteristics, development, and application of
the surface finish technologies for chip pack... [more]
CPM2005-100 ICD2005-110
pp.23-27
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