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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
 Results 1 - 4 of 4  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
SDM 2024-02-21
15:50
Tokyo Tokyo University-Hongo-Engineering Bldg.4
(Primary: On-site, Secondary: Online)
[Invited Talk] Recent Studies of WoW and CoW Cu-Cu Hybrid Bonding
Yoshihisa Kagawa, Yukako Ikegami, Takahiro Kamei, Hayato Iwamoto (SSS) SDM2023-87
In recent years, a variety of 3D stacked devices have been proposed. The Cu-Cu hybrid bonding that can realize high dens... [more] SDM2023-87
pp.31-35
SDM 2016-01-22
14:35
Tokyo Sanjo Conference Hall, The University of Tokyo [Invited Talk] Effect of Wafer Thinning on DRAM Characteristics for Bumpless Interconnects and WOW Applications
Y. S. Kim, S. Kodama, Y. Mizushima, T. Nakamura, N. Maeda, K. Fujimoto (Tokodai), A. Kawai (DISCO), T. Ohba (Tokodai) SDM2015-116
(To be available after the conference date) [more] SDM2015-116
pp.33-37
EMCJ 2011-11-25
15:15
Tokyo Univ. of Electro-Communiations Resent malfunctions and mitigations of telecommunication installations
Kazuo Murakawa, Kei Tominaga, Yuichiro Okugawa, Yasunori Ogura, Hidenori Itou (NTT EAST) EMCJ2011-93
Recently, more than 70% malfunctions (noise sound on telephone sets, link dropping on ADSL modem etc) are occurred at cu... [more] EMCJ2011-93
pp.31-36
ICD, SDM 2010-08-27
10:15
Hokkaido Sapporo Center for Gender Equality [Invited Talk] Development of sub-10um Thinning Technology using Actual Device Wafers
Nobuhide Maeda, Kim Youngsuk (Univ. of Tokyo), Yukinobu Hikosaka, Takashi Eshita (FSL), Hideki Kitada, Koji Fujimoto (Univ. of Tokyo), Yoriko Mizushima (Fujitsu Labs.), Kousuke Suzuki (DNP), Tomoji Nakamura (Fujitsu Labs.), Akihito Kawai, Kazuhisa Arai (DISCO), Takayuki Ohba (Univ. of Tokyo) SDM2010-141 ICD2010-56
200-mm and 300-mm device wafers were successfully thinned down to less than 10-μm. A 200-nm non-crystalline layer remain... [more] SDM2010-141 ICD2010-56
pp.95-97
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