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 Conference Papers (Available on Advance Programs)  (Sort by: Date Descending)
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Committee Date Time Place Paper Title / Authors Abstract Paper #
IPSJ-SLDM, VLD 2012-05-30
Fukuoka Kitakyushu International Conference Center [Invited Talk] How to Mitigate Reliability-related Issues on Nano-scaled LSIs
Kazutoshi Kobayashi (KIT) VLD2012-5
According to aggressive process scaling, reliability issues on
semiconductor devices are becoming dominant such as vari... [more]
ICD, ITE-IST 2011-07-22
Hiroshima Hiroshima Institute of Technology [Invited Talk] Implementation of Broadband Wireless Communication System Using Frequency-Domain Equalization
Suguru Kameda (Tohoku Univ.) ICD2011-35
Frequency-domain equalization (FDE) method is necessary
for realizing "Dependable Air",
which is broadband and wide-ar... [more]
(Joint) [detail]
Kochi Kochi City Culture-Plaza [Panel Discussion] EMC Circuit Design and Jisso Design for System LSI -- Proposal for Circuit Design Managing EMC and Jisso Issue from Jisso-side --
Hideki Osaka (HITACHI Ltd.), Hideki Asai (Shizuoka Univ.), Hidefumi Ibe (HITACHI Ltd.), Yoshiyuki Saito (Panasonic), Takashi Harada (NEC), Narimasa Takahashi (IBM Japan) CPM2009-142 ICD2009-71
Nowadays, a JISSO design is very important to get the target performance out of a system LSI. More specifically, co-desi... [more] CPM2009-142 ICD2009-71
OPE, LQE 2008-06-27
Tokyo Kikai-Shinko-Kaikan Bldg High-Power Single-Stripe Full-Band Tunable Laser Using Tunable Reflector with Wavelength-Filter Function
Tsutomu Ishikawa, Toyotoshi Machida, Hirokazu Tanaka, Toshimitsu Kaneko, Yoshiki Oka, Mikio Tajima, Hajime Shoji, Takuya Fujii (EUD) OPE2008-29 LQE2008-30
Full-band tunable lasers with monolithically-integrated single-stripe structure are key devices for low-cost and high-ca... [more] OPE2008-29 LQE2008-30
CPM, ICD 2008-01-18
Tokyo Kikai-Shinko-Kaikan Bldg Study on Low Stress Condition of Pseudo-SOC Integration Using Stress Analysis
Yutaka Onozuka, Hiroshi Yamada, Atsuko Iida, Kazuhiko Itaya, Hideyuki Funaki (Toshiba R & D Center) CPM2007-141 ICD2007-152
The authors have proposed a pseudo-SOC (System on Chip) technology, forming redistribution global layer with semiconduct... [more] CPM2007-141 ICD2007-152
ED, SDM 2007-06-25
Overseas Commodore Hotel Gyeongju Chosun, Gyeongju, Korea Development of an Integrated Inductor for Impedance Matching on the Fully Integrated Silicon Smart Microsensors
Jong-Wan Kim, Hidekuni Takao, Kazuaki Sawada, Makoto Ishida (Toyohashi Univ. of Tech.)
This paper presents the development of impedance matching procedure of the on-chip integrated antenna and integrated tra... [more]
SIP, CAS, CS 2007-03-06
Tottori Blancart Misasa (Tottori) [Poster Presentation] A Study on Thermal Conduction and Distribution in Package for SiC-SBD
Tsuyoshi Funaki, Akira Nishio, Takashi Hikihara (Kyoto Univ.) CAS2006-98 SIP2006-199 CS2006-115
Electrical characeristics of semiconductor devices vary with temperature. Thermal influence becomes more important for S... [more] CAS2006-98 SIP2006-199 CS2006-115
ICD, CPM 2005-09-08
Tokyo Kikai-Shinko-Kaikan Bldg. Development of Design Techniques for Semiconductor-Package By using Simplified DRAM Macro Model of Power System
Satoshi Nakamura, Takashi Suga (Hitachi PERL), Mitsuaki Katagiri, Yoji Nishio, Seiji Funaba, Yukitoshi Hirose, イサ サトシ (Elpida)
In late years, MCP(Multi Chip Package) and SiP(System in Package) which has plural semiconductor chips in one package be... [more] CPM2005-87 ICD2005-97
ICD, CPM 2005-09-08
Tokyo Kikai-Shinko-Kaikan Bldg. Basic Study of Proper Circuit Line Structure for Advanced System in Package
Shouhei Yasuda (Melco Display Tech.), Yoshiharu Iwata, Ryohei Satoh (Osaka Univ.)
Although the semiconductor has raised performance by speeding up of the clock frequency and shrinking the process rule, ... [more] CPM2005-91 ICD2005-101
ICD, CPM 2005-09-09
Tokyo Kikai-Shinko-Kaikan Bldg. Simultaneous switching noise(SSN) and EMI of a semiconductor package
Takanobu Kushihira (MSC), Toshio Sudo (TSB)
We tested a series about a Simultaneous Switching Noise(SSN) by influence of the parasitism inductance that a package ha... [more] CPM2005-101 ICD2005-111
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