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All Technical Committee Conferences (Searched in: All Years)
| Committee | Date Time | Place | Paper Title / Authors | Abstract | Paper # | |
| MW | 2023-12-22 11:15 |
Shizuoka | Shizuoka University (Hamamatsu Campus) (Primary: On-site, Secondary: Online) |
28 GHz band highly efficient GaAs rectenna MMIC with EM coupling structure for an external highly efficient wire antenna Naoki Sakai, Yudai Tondokoro, Akinobu Kobayashi, Keisuke Noguchi, Masaomi Tsuru, Kenji Itoh (KIT) |
(To be available after the conference date) [more] | |
| NS, RCS (Joint) |
2023-12-14 14:10 |
Fukuoka | Kyushu Institute of Technology Tobata campus, and Online (Primary: On-site, Secondary: Online) |
[Invited Talk]
A View of the Future Created by Small Atomic Clock Hiroshi Ochi (Kyutech), Yuhei Nagao (Radrix) |
(To be available after the conference date) [more] | |
| ICD, HWS | 2023-10-31 15:00 |
Mie | (Primary: On-site, Secondary: Online) |
Side-Channel Leakage Evaluation of 3D CMOS Chip Stacking Kazuki Monta, Rikuu Hasegawa, Takuji Miki, Makoto Nagata (Kobe Univ.)  HWS2023-57 ICD2023-36 |
2.5D and 3D packaging are methodologies that include multiple integrated circuit (IC) chips. They deliver enhanced perfo... [more] | HWS2023-57 ICD2023-36 pp.16-19 |
| MW, AP (Joint) |
2023-09-28 16:15 |
Kochi | Kochi Castle Museum of History (Primary: On-site, Secondary: Online) |
Comparison of Transmission Characteristics of Wire Bonding and Flip Chip Bonding by Electromagnetic Simulation Takuichi Hirano (Tokyo City Univ.) MW2023-85 |
Wire bonding connections and flip-chip connections are mainly used to connect RF chips and substrates. In this paper, th... [more] | MW2023-85 pp.22-27 |
| RECONF | 2023-09-14 16:30 |
Tokyo | Tokyo University of Agriculture and Technology Koganei campus (Primary: On-site, Secondary: Online) |
RECONF2023-23 |
Several research institutes and companies have developed FPGA clusters as one of the methods for accelerating large-scal... [more] | RECONF2023-23 pp.15-17 |
| LQE, OPE, CPM, EMD, R | 2023-08-25 09:50 |
Miyagi | Tohoku university (Primary: On-site, Secondary: Online) |
[Invited Talk]
Progress and Future Prospect of Photonic Integrated Devices using InP Chip/SOI Wafer Bonding Technique Hideki Yagi (PETRA), Nobuhiko Nishiyama (Tokyo Tech), Naoki Fujiwara, Masaki Yanagisawa (PETRA) R2023-28 EMD2023-23 CPM2023-33 OPE2023-72 LQE2023-19 |
The development of beyond fifth-generation (5G) and sixth-generation (6G) mobile communication systems is accelerating t... [more] | R2023-28 EMD2023-23 CPM2023-33 OPE2023-72 LQE2023-19 pp.59-62 |
| CPSY, DC, IPSJ-ARC [detail] | 2023-08-03 16:50 |
Hokkaido | Hakodate Arena (Primary: On-site, Secondary: Online) |
Consideration of Bus Arbitration Method for Inductive Coupling Interface Hideto Kayashima, Aika Kamei (Keio Univ.), Takuya Kojima (Tokyo Univ.), Hideharu Amano (Keio Univ.) CPSY2023-17 DC2023-17 |
(To be available after the conference date) [more] | CPSY2023-17 DC2023-17 pp.55-60 |
| SDM, ICD, ITE-IST [detail] | 2023-08-01 11:10 |
Hokkaido | Hokkaido Univ. Multimedia Education Bldg. 3F (Primary: On-site, Secondary: Online) |
Evaluation on Flip-Chip Packaging for Quantum Computers at Cryogenic Temperature Misato Taguchi, Ryozo Takahashi (Kobe Univ.), Masako Kato, Nobuhiro Kusuno (Hitachi, Ltd), Takuji Miki, Makoto Nagata (Kobe Univ.) SDM2023-37 ICD2023-16 |
Quantum Computers are the most promising technologies to archive more complex calculations. At the same time, much large... [more] | SDM2023-37 ICD2023-16 pp.10-13 |
| HWS | 2023-04-14 15:10 |
Oita | (Primary: On-site, Secondary: Online) |
Electromagnetic fault injection attacks on cryptographic IC chips and analysis of internal voltage fluctuation Rikuu Hasegawa, Takuya Wadatsumi, Kazuki Monta, Takuji Miki, Makoto Nagata (Kobe Univ) HWS2023-5 |
Cryptographic IC chips are subject to the threat of fault injection attacks, which cause circuit malfunctions through in... [more] | HWS2023-5 pp.16-19 |
| HWS, VLD | 2023-03-02 09:55 |
Okinawa | (Primary: On-site, Secondary: Online) |
Implementation of power-outage tolerant VLSI system using asynchronous circuits Masashi Imai (Hirosaki Univ.) VLD2022-86 HWS2022-57 |
Re-initialization free systems which contain nonvolatile memory have been proposed in order to cope with power-outage. H... [more] | VLD2022-86 HWS2022-57 pp.79-84 |
| VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] | 2022-11-28 13:05 |
Kumamoto | (Primary: On-site, Secondary: Online) |
Development of ASIC Prototype Chip Evaluation System using FPGA-SoM Masashi Imai (Hirosaki Univ.), Kenji Kise (Tokyo Tech.), Tomohiro Yoneda (NII) VLD2022-19 ICD2022-36 DC2022-35 RECONF2022-42 |
An ASIC prototype chip requires the corresponding evaluation system based on its specification, resulting in lack of ver... [more] | VLD2022-19 ICD2022-36 DC2022-35 RECONF2022-42 pp.1-6 |
| VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] | 2022-11-29 15:05 |
Kumamoto | (Primary: On-site, Secondary: Online) |
Evaluation of power delivery networks in secure semiconductor systems Masaru Mashiba, Kazuki Monta (Kobe Univ.), Takaaki Okidono (SCU), Takuzi Miki, Makoto Nagata (Kobe Univ.) VLD2022-33 ICD2022-50 DC2022-49 RECONF2022-56 |
With the development of the IoT, hardware security is becoming increasingly important. Physical attacks on cryptoprocess... [more] | VLD2022-33 ICD2022-50 DC2022-49 RECONF2022-56 pp.82-86 |
| VLD, DC, RECONF, ICD, IPSJ-SLDM [detail] | 2022-11-30 09:30 |
Kumamoto | (Primary: On-site, Secondary: Online) |
A contact angle estimation method using two coplanar capacitive sensors of different sizes Tsubasa Furuta, Akira Tsuchiya, Toshiyuki Inoue, Keiji Kishine (USP) VLD2022-42 ICD2022-59 DC2022-58 RECONF2022-65 |
In this paper, we propose a contact angle estimation using coplanar capacitors. To measure the shape of droplet on a chi... [more] | VLD2022-42 ICD2022-59 DC2022-58 RECONF2022-65 pp.133-137 |
| NLP | 2022-11-24 16:40 |
Shiga | (Primary: On-site, Secondary: Online) |
Photonic reservoir computing with optical microcavities Kohei Arai, Tomoya Yamaguchi, Tomoaki Niiyama, Satoshi Sunada (Kanazawa Univ.) NLP2022-67 |
Neural networks (NNs), which mimic the function of neural circuits in the brain, use electrons to perform arithmetic ope... [more] | NLP2022-67 pp.43-48 |
| HWS, ICD | 2022-10-25 11:50 |
Shiga | (Primary: On-site, Secondary: Online) |
Optical Microscopic Observation of Semiconductor Devices toward Hardware Trojan Detection Hirofumi Sakane, Junichi Sakamoto, Shinichi Kawamura (AIST), Makoto Nagata (Kobe Univ.), Yuichi Hayashi (NAIST) HWS2022-34 ICD2022-26 |
In this paper we focus on detection of hardware Trojan (HT) in semiconductor devices under a scenario with following ste... [more] | HWS2022-34 ICD2022-26 pp.23-28 |
| CPSY, DC, IPSJ-ARC [detail] | 2022-10-12 09:00 |
Niigata | Yuzawa Toei Hotel (Primary: On-site, Secondary: Online) |
Design and Implementation of Network Protocol for Shape-Changeable Computer System Shun Nagasaki, Junichiro Kadomoto, Hidetsugu Irie, Shuichi Sakai (UTokyo) CPSY2022-21 DC2022-21 |
Shape-changeable computer system, in which a large number of computer chips arranged next to each other communicate wire... [more] | CPSY2022-21 DC2022-21 pp.20-25 |
| ICD, SDM, ITE-IST [detail] | 2022-08-08 15:20 |
Online | Evaluation of IC Chip Response by Backside Voltage Disturbance in Flip Chip Packaging Takuya Wadatsumi, Kohei Kawai, Rikuu Hasegawa (Kobe Univ.), Kikuo Muramatsu (e-SYNC), Hiromu Hasegawa, Takuya Sawada, Takahito Fukushima, Hisashi Kondo (Megachips), Takuji Miki, Makoto Nagata (Kobe Univ.) SDM2022-40 ICD2022-8 |
Flip chip packaging has become a general technique for mounting semiconductor ICs due to the need for smaller area. Howe... [more] | SDM2022-40 ICD2022-8 pp.27-30 |
|
| RECONF | 2022-06-07 14:25 |
Ibaraki | CCS, Univ. of Tsukuba (Primary: On-site, Secondary: Online) |
Performance Evaluation of Fault-Tolerant Routing Methods Using NAS Parallel Benchmarks Yota Kurokawa, Masaru Fukushi (Yamaguchi Univ.) RECONF2022-4 |
This paper proposes an evaluation method of fault-tolerant routing methods developed for Network-on-Chips (NoCs) using p... [more] | RECONF2022-4 pp.20-25 |
| MW | 2022-03-03 09:35 |
Online | Online | Chip Resistors for Heat Dissipation on RF circuits Yuta Sugiyama, Hidenori Ishibashi, Takeshi Oshima, Hidenori Yukawa, Toru Fukasawa, Toru Takahashi, Yoshio Inasawa (Mitsubishi Electric) MW2021-112 |
In this paper we present that the technology of heat dissipation for RF circuit using chip resistors. The quarter wavele... [more] | MW2021-112 pp.7-11 |
| ED, MW | 2022-01-27 14:40 |
Online | Online | [Invited Lecture]
Study of compact diplexer using common resonators consisting of coupled lines and chip capacitors Satoshi Ono, Koji Wada (UEC) ED2021-65 MW2021-107 |
A chip capacitor coupled common resonator which consisted chip capacitor loaded type coupled line resonators is proposed... [more] | ED2021-65 MW2021-107 pp.16-21 |
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