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Technical Committee on Reliability (R)  (Searched in: 2010)

Search Results: Keywords 'from:2010-11-19 to:2010-11-19'

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Search Results: Conference Papers
 Conference Papers (Available on Advance Programs)  (Sort by: Date Ascending)
 Results 1 - 5 of 5  /   
Committee Date Time Place Paper Title / Authors Abstract Paper #
R 2010-11-19
Osaka   Evaluation of degradation at a solder connected point due to electromigration
Akihiro Higuchi, Kazunori Hiraoka (Salesian Poly.) R2010-32
 [more] R2010-32
R 2010-11-19
Osaka   Performance Degradation of Photovoltaic Modules with Rapid Thermal-Cycling
Yuichi Aoki, Manabu Okamoto (Espec Corp.), Atsushi Masuda, Takuya Doi (AIST) R2010-33
To clarify the failure-mode of crystalline-silicon photovoltaic modules on the thermal-cycle test, the modules were expo... [more] R2010-33
R 2010-11-19
Osaka   The improvement of the sealing reliability of relays by the means of reducing permeability in sealing adhesives
Tomohiro Fukuhara, Mitsuo Ito, Osamu Otani (OMRON) R2010-34
Relays are used for various purposes, and are demanded for high operating reliability in a variety of environments. Seal... [more] R2010-34
R 2010-11-19
Osaka   A Bootstrap Software Reliability Assessment Method in the Final Stage of Software Testing Process
Takaji Fujiwara (Biz3), Mitsuhiro Kimura (Hosei Univ.) R2010-35
This paper develops a bootstrap software reliability assessment method which can evaluate the number of remaining softwa... [more] R2010-35
R 2010-11-19
Osaka   Inference of Reliability for Degradation Data Based on Stochastic Process Models
Toru Kaise (Univ. of Hyogo) R2010-36
 [more] R2010-36
 Results 1 - 5 of 5  /   
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